XPD720BP25

@@ -0,0 +1,55 @@+# XPD720BP25++**Shenzhen Fuman** · USB Converters · ESOP-8++XPD720BP25 from Shenzhen Fuman, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VPWR | power_in | Chip input supply, 3.6 V to 21 V typical (max 25 V abs). UVLO rising 3.3 V, falling 2.9 V. Requires ~10 µF (min 4.7 µF) decoupling to GND. |+| 2 | OPTO | output | Optocoupler drive output. Sinks/sources current into the AC-DC / DC-DC feedback loop to dynamically adjust the primary-side regulator's output voltage for PD/PPS operation. |+| 3 | VFB | input | Voltage regulation feedback input, connected to the front-end power supply feedback divider (typ. R_FB1 = 100 kΩ upper, R_FB2 = 33 kΩ lower). Sensed to close the CV loop and step VBUS across PDO/APDO levels. |+| 4 | DP | bidirectional | Type-C USB 2.0 D+ data line. Used for BC1.2 DCP detection, QC2.0/3.0/3.0+, FCP/SCP/HVSCP, AFC, and Apple 2.4A handshake signalling. Includes over-voltage protection. |+| 5 | DM | bidirectional | Type-C USB 2.0 D- data line. Paired with DP for legacy fast-charge handshakes (QC/FCP/SCP/AFC/BC1.2/Apple). Includes over-voltage protection. |+| 6 | CC1 | bidirectional | Type-C Configuration Channel 1. Drives Rp source (330 µA for 3A advertisement, 180 µA for 1.5A), detects sink attach/orientation, and carries BMC-encoded USB PD 2.0/3.0 / PPS messaging. Includes over-voltage protection. |+| 7 | CC2 | bidirectional | Type-C Configuration Channel 2. Same function as CC1 for the opposite cable orientation; supports Rp advertisement and BMC PD/PPS signalling. Includes over-voltage protection. |+| 8 | VBUS | power_out | Type-C VBUS output. Internally connected via the integrated 10 mΩ power MOSFET and 10 mΩ current-sense resistor. Fast OVP trips at +20% of the target voltage, slow OVP at +15%. Requires optional 1 µF decoupling. |+| 9 | GND | power_in | Exposed thermal / power pad on the underside of the ESOP-8 package. Must be soldered to the PCB ground plane for both electrical ground reference and thermal dissipation (θJA = 42 °C/W). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Shenzhen Fuman |+| Package | ESOP-8 |+| Category | Interface |+| Pins | 9 |++## Ordering variants++- `XPD720BP25`+- `XPD720BP25XPD720A`+- `XPD720BP25XPD720B`+- `XPD720BP25XPD720BP`+- `XPD720BP25XPD720APS25`+- `XPD720BP25XPD720APS30`+- `XPD720BP25XPD720DP30`++## CAD (KiCad official)++- Symbol: `XPD720BP25`+- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm`+- 3D model: ESOP-8 (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Shenzhen Fuman datasheet](docs/xpd720bp25-datasheet.pdf) (12 pp, sha256 `eece9ef9baf57354`, retrieved 2026-08-17, tier: lcsc)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/xpd720bp25-datasheet.pdf)

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