component
XL7005A
Public Made by Adomby adom
XLSEMI DC-DC Converters, SOIC-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+48@@ -0,0 +1,48 @@+# XL7005A++**XLSEMI** · DC-DC Converters · SOIC-8-EP++XL7005A from XLSEMI, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VIN | power_in | Supply Voltage Input Pin. Operates from 5V to 80V DC. Bypass VIN to GND with a suitably large capacitor (typ. 33uF/100V) to eliminate input noise. |+| 2 | SW | output | Power Switch Output Pin. Switch node that supplies power to the output inductor; connects to the external Schottky freewheeling diode and inductor. Absolute max VSW: -0.3V to VIN. |+| 3 | FB | input | Feedback Pin. Senses the output voltage through an external resistor divider and regulates it to a threshold of 1.25V (typ). Vout = 1.25 * (1 + R2/R1). |+| 4 | EN | input | Enable Pin (TTL). Drive EN low (<0.8V typ) to turn ON the regulator; drive high (>1.6V typ) to turn it OFF. Floating defaults to low (ON). Input leakage ~1uA (ON) / ~6uA (OFF). |+| 5 | GND | power_in | Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 6-8 and the exposed pad. |+| 6 | GND | power_in | Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 5,7,8 and the exposed pad. |+| 7 | GND | power_in | Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 5,6,8 and the exposed pad. |+| 8 | GND | power_in | Ground Pin. Must be placed outside the Schottky-to-Cout ground return path to prevent switching current spikes from injecting noise. Tie together with pins 5-7 and the exposed pad. |+| 9 | EP | power_in | Exposed thermal PAD on the underside of the SOP8-EP package. Electrically GND. Solder to the PCB ground plane for thermal dissipation (RJA = 60 degC/W). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | XLSEMI |+| Package | SOIC-8-EP |+| Category | PMIC |+| Pins | 9 |++## Ordering variants++- `XL7005A`++## CAD (KiCad official)++- Symbol: `XL7005A`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8-EP (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [XLSEMI datasheet](docs/xl7005a-datasheet.pdf) (10 pp, sha256 `6a632bb19da8e766`, retrieved 2026-08-17, tier: manufacturer)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/xl7005a-datasheet.pdf)
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