component
XL3001E1
Public Made by Adomby adom
XLSEMI LED Drivers, SOIC-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
orderable attributes: rebuild .lbr with adom-lbr 2.18.0 so MPN, MANUFACTURER and the distributor part numbers reach <technology> (LCSC_PN C73020). The published library carried no attributes at all, so a BOM had nothing to buy from. Distributor PNs matched on exact MPN AND corroborating manufacturer.
2 files changed
+26−6
page.json+6−4@@ -26,7 +26,9 @@ "model_3d_step": "xl3001e1.step", "lbr": "xl3001e1.lbr" },- "distributor_links": {},+ "distributor_links": {+ "lcsc": "C73020"+ }, "pins": [ { "number": "1",@@ -44,13 +46,13 @@ "number": "3", "name": "VC", "type": "passive",- "description": "Internal voltage-regulator bypass pin. Connect a 1 µF ceramic capacitor between VIN and VC in typical applications for internal LDO decoupling."+ "description": "Internal voltage-regulator bypass pin. Connect a 1 \u00b5F ceramic capacitor between VIN and VC in typical applications for internal LDO decoupling." }, { "number": "4", "name": "VIN", "type": "power_in",- "description": "Power supply input, 8 V to 40 V DC (absolute max 45 V). Bypass VIN to GND with an electrolytic capacitor (e.g. 100 µF/50 V) plus a ceramic to suppress switching noise."+ "description": "Power supply input, 8 V to 40 V DC (absolute max 45 V). Bypass VIN to GND with an electrolytic capacitor (e.g. 100 \u00b5F/50 V) plus a ceramic to suppress switching noise." }, { "number": "5",@@ -80,7 +82,7 @@ "number": "9", "name": "EP/SW", "type": "output",- "description": "Exposed thermal pad on the back of the SOP8-EP package. Electrically the SW node (the datasheet notes '背部焊盘为 SW'). Solder to the SW copper pour to conduct switch-node current and heat."+ "description": "Exposed thermal pad on the back of the SOP8-EP package. Electrically the SW node (the datasheet notes '\u80cc\u90e8\u710a\u76d8\u4e3a SW'). Solder to the SW copper pour to conduct switch-node current and heat." } ], "provenance": {
xl3001e1.lbr+20−2@@ -63,6 +63,18 @@ <smd name="7" x="2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1"/> <smd name="8" x="2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1"/> <smd name="9" x="0.0000" y="-0.0000" dx="2.4100" dy="3.3000" layer="1"/>+ <polygon width="0.1200" layer="21">+ <vertex x="-2.6000" y="2.4700"/>+ <vertex x="-2.8400" y="2.8000"/>+ <vertex x="-2.3600" y="2.8000"/>+ </polygon>+ <polygon width="0.1000" layer="51">+ <vertex x="-0.9750" y="2.4500"/>+ <vertex x="1.9500" y="2.4500"/>+ <vertex x="1.9500" y="-2.4500"/>+ <vertex x="-1.9500" y="-2.4500"/>+ <vertex x="-1.9500" y="1.4750"/>+ </polygon> <wire x1="-2.0600" y1="2.5600" x2="2.0600" y2="2.5600" width="0.1200" layer="21"/> <wire x1="-2.0600" y1="2.4650" x2="-2.0600" y2="2.5600" width="0.1200" layer="21"/> <wire x1="-2.0600" y1="-2.5600" x2="-2.0600" y2="-2.4650" width="0.1200" layer="21"/>@@ -71,7 +83,7 @@ <wire x1="2.0600" y1="-2.5600" x2="-2.0600" y2="-2.5600" width="0.1200" layer="21"/> <text x="0" y="3.480" size="1.27" layer="25" align="bottom-center">>NAME</text> <text x="0" y="-3.480" size="1.27" layer="27" align="top-center">>VALUE</text>-<!--adom-pin1--><polygon width="0.0500" layer="21"><vertex x="-2.6000" y="2.4700"/><vertex x="-2.8400" y="2.8000"/><vertex x="-2.3600" y="2.8000"/></polygon></package>+</package> </packages> <symbols> <symbol name="XL3001E1">@@ -111,7 +123,13 @@ <connect gate="G$1" pin="GND@2" pad="7"/> <connect gate="G$1" pin="SW@2" pad="6"/> </connects>- <technologies><technology name=""/></technologies>+ <technologies>+ <technology name="">+ <attribute name="MPN" value="XL3001E1" constant="no"/>+ <attribute name="MANUFACTURER" value="XLSEMI" constant="no"/>+ <attribute name="LCSC_PN" value="C73020" constant="no"/>+ </technology>+ </technologies> </device> </devices> </deviceset>