component
XL3001E1
Public Made by Adomby adom
XLSEMI LED Drivers, SOIC-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+7−4@@ -44,13 +44,13 @@ "number": "3", "name": "VC", "type": "passive",- "description": "Internal voltage-regulator bypass pin. Connect a 1 \u00b5F ceramic capacitor between VIN and VC in typical applications for internal LDO decoupling."+ "description": "Internal voltage-regulator bypass pin. Connect a 1 µF ceramic capacitor between VIN and VC in typical applications for internal LDO decoupling." }, { "number": "4", "name": "VIN", "type": "power_in",- "description": "Power supply input, 8 V to 40 V DC (absolute max 45 V). Bypass VIN to GND with an electrolytic capacitor (e.g. 100 \u00b5F/50 V) plus a ceramic to suppress switching noise."+ "description": "Power supply input, 8 V to 40 V DC (absolute max 45 V). Bypass VIN to GND with an electrolytic capacitor (e.g. 100 µF/50 V) plus a ceramic to suppress switching noise." }, { "number": "5",@@ -80,7 +80,7 @@ "number": "9", "name": "EP/SW", "type": "output",- "description": "Exposed thermal pad on the back of the SOP8-EP package. Electrically the SW node (the datasheet notes '\u80cc\u90e8\u710a\u76d8\u4e3a SW'). Solder to the SW copper pour to conduct switch-node current and heat."+ "description": "Exposed thermal pad on the back of the SOP8-EP package. Electrically the SW node (the datasheet notes '背部焊盘为 SW'). Solder to the SW copper pour to conduct switch-node current and heat." } ], "provenance": {@@ -144,5 +144,8 @@ "docs/xl3001e1-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }