XL3001E1

@@ -0,0 +1,49 @@+# XL3001E1++**XLSEMI** · LED Drivers · SOIC-8-EP++XL3001E1 from XLSEMI, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | CS | input | Output current-sense input. Regulated to an internal 0.21 V reference (IOUT = 0.21 V / RCS). Connect to the high side of the current-sense resistor to set LED current. |+| 2 | NC | unconnected | No connection. Leave floating or tie to any convenient net; the pin is not internally bonded. |+| 3 | VC | passive | Internal voltage-regulator bypass pin. Connect a 1 µF ceramic capacitor between VIN and VC in typical applications for internal LDO decoupling. |+| 4 | VIN | power_in | Power supply input, 8 V to 40 V DC (absolute max 45 V). Bypass VIN to GND with an electrolytic capacitor (e.g. 100 µF/50 V) plus a ceramic to suppress switching noise. |+| 5 | SW | output | Power switching output (drain of internal high-side power MOSFET). Connect to the buck inductor / catch diode node; rated for up to 3 A switching current at 220 kHz. Electrically tied to the exposed metal pad on the package back. |+| 6 | SW | output | Power switching output (drain of internal high-side power MOSFET). Tie to pin 5 and to the exposed pad; carries the buck switch-node current. |+| 7 | GND | power_in | Device ground. Tie to pin 8 and to the PCB ground plane; return path for VIN bypass and CS sense resistor. |+| 8 | GND | power_in | Device ground. Tie to pin 7 and to the PCB ground plane. |+| 9 | EP/SW | output | Exposed thermal pad on the back of the SOP8-EP package. Electrically the SW node (the datasheet notes '背部焊盘为 SW'). Solder to the SW copper pour to conduct switch-node current and heat. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | XLSEMI |+| Package | SOIC-8-EP |+| Category | LED-drv |+| Pins | 9 |++## Ordering variants++- `XL3001E1E1`++## CAD (KiCad official)++- Symbol: `XL3001E1`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8-EP (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [XLSEMI datasheet](docs/xl3001e1-datasheet.pdf) (13 pp, sha256 `7ac593a3adc03e11`, retrieved 2026-08-17, tier: manufacturer)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/xl3001e1-datasheet.pdf)

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