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XL1509-12
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UMW DC-DC Converters, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+48@@ -0,0 +1,48 @@+# XL1509-12++**UMW** · DC-DC Converters · SOP-8++XL1509-12 from UMW, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VIN | power_in | Supply Voltage Input Pin. Operates from 4.5V to 40V DC (absolute max 45V). Bypass VIN to GND with a suitably large capacitor to eliminate input noise. |+| 2 | OUTPUT | output | Power Switch Output Pin (SW). Internal power transistor switch node that supplies power to the output LC filter. Rated for 2A continuous, internal current limit ~4A. Absolute max -0.3V to VIN. |+| 3 | FEEDBACK | input | Feedback Pin (FB). Senses the output voltage through an external resistor divider and regulates it. Internal feedback threshold is 1.23V. For the fixed 12V variant the internal divider sets VOUT = 12V (typ, range 11.52V-12.48V). |+| 4 | ON/OFF | input | Enable/Shutdown pin with hysteresis. Drive low (<0.8V) to turn the regulator ON, drive high (>1.4V) to turn it OFF. TTL-compatible; floating defaults to low (ON). Input leakage ~5 uA. |+| 5 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. |+| 6 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. |+| 7 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. |+| 8 | GND | power_in | Ground pin. Route outside the Schottky-diode-to-output-capacitor ground path to avoid coupling switching current spikes into the IC. Tie all GND pins (5,6,7,8) together at the ground plane. On ESOP-8 these pins are also connected to the exposed thermal pad for heatsinking. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | UMW |+| Package | SOP-8 |+| Category | PMIC |+| Pins | 8 |++## Ordering variants++- `XL1509-12E1`+- `XL1509-12E1`++## CAD (KiCad official)++- Symbol: `XL1509-12`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOP-8 (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [UMW datasheet](docs/xl1509-12-datasheet.pdf) (15 pp, sha256 `bd5713838034a224`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/xl1509-12-datasheet.pdf)
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