XB8089D0

@@ -0,0 +1,48 @@+# XB8089D0++**XySemi** · Battery Management · SOP-8-EP++XB8089D0 from XySemi, in a SOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VM | bidirectional | Negative terminal of the battery pack (B-/load side). The internal FET switch connects this terminal to GND during normal operation. Pins 1-4 are internally tied together and carry the pack current through the integrated MOSFETs. |+| 2 | VM | bidirectional | Negative terminal of the battery pack (B-/load side). Internally connected to the source of the integrated protection MOSFETs; tie to pins 1, 3, 4 externally. |+| 3 | VM | bidirectional | Negative terminal of the battery pack (B-/load side). Internally connected to the source of the integrated protection MOSFETs; tie to pins 1, 2, 4 externally. |+| 4 | VM | bidirectional | Negative terminal of the battery pack (B-/load side). Internally connected to the source of the integrated protection MOSFETs; tie to pins 1, 2, 3 externally. |+| 5 | GND | power_in | Ground reference. Connect the negative terminal of the battery cell (BAT-) to this pin. Pins 5, 7 and 8 are internally tied and share the ground return. |+| 6 | VDD | power_in | Power supply pin. Connect through a 1 kΩ resistor (typical) and a 0.1 µF bypass capacitor to the positive terminal of the battery cell (BAT+). Absolute max −0.3 V to +6 V. |+| 7 | GND | power_in | Ground reference. Tied internally to pins 5 and 8; connect to BAT-. |+| 8 | GND | power_in | Ground reference. Tied internally to pins 5 and 7; connect to BAT-. |+| 9 | EPAD | power_in | Exposed thermal pad on the underside of the SOP8-PP package. Must be soldered to the GND copper pour for thermal dissipation of the integrated MOSFETs. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | XySemi |+| Package | SOP-8-EP |+| Category | PMIC |+| Pins | 9 |++## Ordering variants++- `XB8089D0`++## CAD (KiCad official)++- Symbol: `XB8089D0`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOP-8-EP (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [XySemi datasheet](docs/xb8089d0-datasheet.pdf) (12 pp, sha256 `85596e0e8a7846b1`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/xb8089d0-datasheet.pdf)

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