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w25q64jwssiq: backfill missing artifacts (variants)

Ray ·d71149acee ·1mo ago ·parent 0bc2c52
2 files changed +61−1
README.md+2
@@ -28,6 +28,8 @@ W25Q64JWSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions  ## Ordering variants +Same part, different packaging or reel option.+ - `W25Q64JWSSIQ` - `W25Q64JWSSIQSSIG` - `W25Q64JWSSIQZPIQ`
page.json+59−1
@@ -155,5 +155,63 @@   ],   "visibility": {     "public": true-  }+  },+  "variants": [+    {+      "mpn": "W25Q64JWSSIQ",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQSSIG",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQZPIQ",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQZPIG",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQZEIQ",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQZEIG",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQUUIQ",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQUUIG",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQXGIQ",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQXGIG",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQTBIQ",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQTBIG",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQBYIQ",+      "kind": "packaging"+    },+    {+      "mpn": "W25Q64JWSSIQBYIG",+      "kind": "packaging"+    }+  ] }\ No newline at end of file