W25Q64JWSSIQ

@@ -0,0 +1,60 @@+# W25Q64JWSSIQ++**Winbond Elec** · NOR FLASH · SOIC-8-208mil++W25Q64JWSSIQ from Winbond Elec, in a SOIC-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | /CS | input | Chip Select input, active low. When high the device is deselected and DO/IO pins are high-impedance; when low the device is selected and instructions can be written/read. /CS must track VCC at power-up/down; a pull-up on /CS is recommended. |+| 2 | DO (IO1) | bidirectional | Serial Data Output for Standard SPI (unidirectional, data shifted out on falling edge of CLK). Becomes bidirectional IO1 for Dual/Quad SPI instructions. |+| 3 | /WP (IO2) | bidirectional | Write Protect input, active low, used with the Status Register block-protect and SRP bits to hardware-protect a portion of memory. Becomes bidirectional IO2 when Quad Enable (QE) bit is set for Quad SPI operation. |+| 4 | GND | power_in | Ground reference for the device. |+| 5 | DI (IO0) | bidirectional | Serial Data Input for Standard SPI (unidirectional, sampled on rising edge of CLK). Becomes bidirectional IO0 for Dual/Quad SPI instructions. |+| 6 | CLK | input | SPI Serial Clock input providing timing for serial input and output operations. Supports clock frequencies up to 133MHz. |+| 7 | /HOLD (IO3) | bidirectional | /HOLD input (active low) pauses device operation while /CS is low, tri-stating DO and ignoring DI/CLK. Becomes bidirectional IO3 when Quad Enable (QE) bit is set for Quad SPI operation. Hardware /RESET function is NOT available on the 8-pin SOIC package (only on SOIC-16 and TFBGA). |+| 8 | VCC | power_in | Power supply, 1.7V to 1.95V single supply. Power-down current typ <1uA. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Winbond Elec |+| Package | SOIC-8-208mil |+| Category | Memory |+| Pins | 8 |++## Ordering variants++- `W25Q64JWSSIQSSIQ`+- `W25Q64JWSSIQSSIG`+- `W25Q64JWSSIQZPIQ`+- `W25Q64JWSSIQZPIG`+- `W25Q64JWSSIQZEIQ`+- `W25Q64JWSSIQZEIG`+- `W25Q64JWSSIQUUIQ`+- `W25Q64JWSSIQUUIG`+- `W25Q64JWSSIQXGIQ`+- `W25Q64JWSSIQXGIG`+- `W25Q64JWSSIQTBIQ`+- `W25Q64JWSSIQTBIG`+- `W25Q64JWSSIQBYIQ`+- `W25Q64JWSSIQBYIG`++## CAD (KiCad official)++- Symbol: `W25Q64JWSSIQ`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8-208mil (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Winbond Elec datasheet](docs/w25q64jwssiq-datasheet.pdf) (77 pp, sha256 `8afcf97374895da3`, retrieved 2026-08-17, tier: lcsc)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/w25q64jwssiq-datasheet.pdf)

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