component
TLV5624CD
Public Made by Adomby adom
Texas Instruments Digital To Analog Converters (DAC), SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+44@@ -0,0 +1,44 @@+# TLV5624CD++**Texas Instruments** · Digital To Analog Converters (DAC) · SOIC-8++TLV5624CD from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | DIN | input | Digital serial data input; the 16-bit word (4 control bits and 8 data bits) is shifted in MSB first on high-to-low SCLK transitions. |+| 2 | SCLK | input | Digital serial clock input, with a maximum serial clock frequency of 20 MHz. |+| 3 | CS | input | Active-low chip select that enables or disables the serial inputs; it can be tied low in three-wire operation. |+| 4 | FS | input | Frame sync input; a falling edge starts the serial shift, and the DAC latch updates after 16 bits have been clocked in or when FS rises. |+| 5 | AGND | power_in | Analog ground reference for the DAC, to be connected to the system analog ground plane. |+| 6 | REF | bidirectional | Reference voltage input/output; requires a 0.1 µF bypass capacitor, plus a 10 µF capacitor when the internal reference is used, and the external reference must be selected in the control register when an external reference is applied (input range 0 V to VDD−1.5 V). |+| 7 | OUT | output | DAC A analog voltage output from the rail-to-rail x2 buffer, specified for a minimum load of 2 kΩ and a maximum load capacitance of 100 pF. |+| 8 | VDD | power_in | Positive power supply, 4.5 V to 5.5 V at VDD = 5 V nominal or 2.7 V to 3.3 V at VDD = 3 V nominal. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | SOIC-8 |+| Category | Data Acquisition |+| Pins | 8 |++## CAD (KiCad official)++- Symbol: `TLV5624CD`+- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`+- 3D model: SOIC-8 (KiCad packages3D, STEP)+- 3D model files: `tlv5624cd-etched.step` / `tlv5624cd-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tlv5624cd.step` / `tlv5624cd.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tlv5624) (26 pp, sha256 `5ae4849781b211d0`, retrieved 2026-10-08, tier: lcsc)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/tlv5624cd-datasheet.pdf)
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