component
SY8745FCC
Public Made by Adomby adom
Silergy Corp LED Drivers, SOIC-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+8−5@@ -50,19 +50,19 @@ "number": "4", "name": "GND", "type": "power_in",- "description": "Ground pin. Also tied to the exposed thermal pad on the SO8E package. Provide a large copper area / ground plane for thermal and noise performance (\u0398JA=30\u00b0C/W, \u03b8JC=10\u00b0C/W)."+ "description": "Ground pin. Also tied to the exposed thermal pad on the SO8E package. Provide a large copper area / ground plane for thermal and noise performance (ΘJA=30°C/W, θJC=10°C/W)." }, { "number": "5", "name": "IN", "type": "power_in",- "description": "Input supply pin (10-60V operating, 63V absolute max). Decouple this pin to GND with a 1\u00b5F (or larger) X7R ceramic capacitor placed close to IN/GND. Also serves as the positive terminal of the internal current sense (VIN-VSEN)."+ "description": "Input supply pin (10-60V operating, 63V absolute max). Decouple this pin to GND with a 1µF (or larger) X7R ceramic capacitor placed close to IN/GND. Also serves as the positive terminal of the internal current sense (VIN-VSEN)." }, { "number": "6", "name": "SEN", "type": "input",- "description": "Negative current sense input. Connects to the LED-side of the external current sense resistor RSEN (RSEN = 0.1V / ILED). Typical current sense limit 100mV (VIN-VSEN). Recommended operating range is VIN \u00b1 0.4V (absolute max VIN \u00b1 0.6V)."+ "description": "Negative current sense input. Connects to the LED-side of the external current sense resistor RSEN (RSEN = 0.1V / ILED). Typical current sense limit 100mV (VIN-VSEN). Recommended operating range is VIN ± 0.4V (absolute max VIN ± 0.6V)." }, { "number": "7",@@ -80,7 +80,7 @@ "number": "EP", "name": "GND", "type": "power_in",- "description": "Exposed thermal pad on the underside of the SO8E package, electrically tied to GND (pin 4). Solder to a large ground copper pour for thermal dissipation (PD=3.3W @ 25\u00b0C)."+ "description": "Exposed thermal pad on the underside of the SO8E package, electrically tied to GND (pin 4). Solder to a large ground copper pour for thermal dissipation (PD=3.3W @ 25°C)." } ], "provenance": {@@ -150,5 +150,8 @@ "docs/sy8745fcc-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }