component
ST1S14PHR
Public Made by Adomby adom
STMicroelectronics DC-DC Converters, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+9−6@@ -38,25 +38,25 @@ "number": "2", "name": "PG", "type": "output",- "description": "Power good open-collector output. Asserts when VFB reaches ~0.92*VOUT (rising) and de-asserts at ~0.8*VOUT (falling). VOL \u2264 0.4 V at ISINK = 6 mA. Requires an external pull-up. Absolute max -0.3 to (VIN+0.3) V."+ "description": "Power good open-collector output. Asserts when VFB reaches ~0.92*VOUT (rising) and de-asserts at ~0.8*VOUT (falling). VOL ≤ 0.4 V at ISINK = 6 mA. Requires an external pull-up. Absolute max -0.3 to (VIN+0.3) V." }, { "number": "3", "name": "EN1", "type": "input",- "description": "Active-low enable input. Device is ON when EN1 is low (\u22640.5 V) and EN2 is high (\u22651.5 V). Biasing current ~1.6 \u00b5A at 5 V. Absolute max -0.3 to 7 V."+ "description": "Active-low enable input. Device is ON when EN1 is low (≤0.5 V) and EN2 is high (≥1.5 V). Biasing current ~1.6 µA at 5 V. Absolute max -0.3 to 7 V." }, { "number": "4", "name": "FB", "type": "input",- "description": "Feedback voltage input to the error amplifier. Internal reference is typ. 1.22 V (1.202-1.239 V). Bias current \u226450 nA. Connect to the external resistor divider from VOUT. Absolute max -0.3 to 3 V."+ "description": "Feedback voltage input to the error amplifier. Internal reference is typ. 1.22 V (1.202-1.239 V). Bias current ≤50 nA. Connect to the external resistor divider from VOUT. Absolute max -0.3 to 3 V." }, { "number": "5", "name": "EN2", "type": "input",- "description": "Active-high enable input. Device is ON only when EN2 is high (\u22651.5 V) and EN1 is low. Biasing current up to 10 \u00b5A. Absolute max -0.3 to (VIN+0.3) V."+ "description": "Active-high enable input. Device is ON only when EN2 is high (≥1.5 V) and EN1 is low. Biasing current up to 10 µA. Absolute max -0.3 to (VIN+0.3) V." }, { "number": "6",@@ -80,7 +80,7 @@ "number": "EP", "name": "EP", "type": "power_in",- "description": "Exposed thermal pad on the underside of the HSOP-8 package. Must be soldered to the GND plane to provide the primary thermal path (RthJA \u2248 40 \u00b0C/W) and complete the ground connection."+ "description": "Exposed thermal pad on the underside of the HSOP-8 package. Must be soldered to the GND plane to provide the primary thermal path (RthJA ≈ 40 °C/W) and complete the ground connection." } ], "provenance": {@@ -144,5 +144,8 @@ "docs/st1s14phr-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }