Commit History

19 commits ← Back to Activity
ssp7785-3-3v: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
Ray · 9ca5e98 ·
ssp7785-3-3v: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
Ray · c6d4b7e ·
ssp7785-3-3v: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Ray · 1151fba ·
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
Ray · f48238b ·
ssp7785-3-3v: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Ray · f46aa3f ·
ssp7785-3-3v: backfill missing artifacts (mfr)
Ray · 4c10e5b ·
ssp7785-3-3v: publish the laser-etched STEP alongside the bare one
Ray · 385185f ·
Publish 0.2.0
Ray · 40fd2de ·
rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an…
Ray · 4affd62 ·
orderable attributes: rebuild .lbr with adom-lbr 2.18.0 so MPN, MANUFACTURER and the distributor part numbers reach <te…
Ray · 89bcd5b ·
rebuild .lbr with adom-lbr 2.18.0: sanitises the pin name ['EXPOSED PAD'] EAGLE cannot carry, carries the F.SilkS pin-1…
Ray · 0902c78 ·
add symbol pin "9" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no…
Ray · 529c255 ·
pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left)
Ray · db18926 ·
fix footprint: SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm -> SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm (3d refresh; body…
Ray · fe5bc81 ·
Set visibility: public
Ray · f083a6b ·
ssp7785-3-3v: viewers
Ray · 3403dbe ·
ssp7785-3-3v: factory component page (tier=lcsc)
Ray · 71b7bb2 ·
Publish 0.1.0
Ray · 1f197a6 ·
Initial commit: component/ssp7785-3-3v
Ray · 423b6d3 ·