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ssp61cc2302mr: backfill missing artifacts (variants)

Ray ·83e8c3994b ·1mo ago ·parent 199f2f6
2 files changed +13−1
README.md+2
@@ -23,6 +23,8 @@ SSP61CC2302MR from Shanghai Siproin Microelectronics, in a SOT-23. Pinout and pi  ## Ordering variants +Same part, different packaging or reel option.+ - `SSP61CC2302MRM` - `SSP61CC2302MRN` 
page.json+11−1
@@ -112,5 +112,15 @@   ],   "visibility": {     "public": true-  }+  },+  "variants": [+    {+      "mpn": "SSP61CC2302MRM",+      "kind": "packaging"+    },+    {+      "mpn": "SSP61CC2302MRN",+      "kind": "packaging"+    }+  ] }\ No newline at end of file