smd1206b050tf: symbol repaired (fuse)
smd1206b050tf: symbol repaired (fuse)
smd1206b050tf: hero GLB from the etched model (keeps the MPN mark)
smd1206b050tf: rebuilt as a full factory component page (was a placeholder)
smd1206b050tf: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
smd1206b050tf: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
smd1206b050tf: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
smd1206b050tf: laser-etched CAD + chip hero (factory 2.0.0 backfill)
smd1206b050tf: backfill missing artifacts (variants)
smd1206b050tf: publish the laser-etched STEP alongside the bare one
smd1206b050tf: factory component page (tier=lcsc)
Initial commit: component/smd1206b050tf