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Set visibility: public

Ray ·18e03a91b0 · ·parent 66d00ef
1 file changed +9−6
page.json+9−6
@@ -32,7 +32,7 @@         "number": "1",         "name": "DRAIN",         "type": "power_out",-        "description": "Drain of the internal high-voltage power MOSFET (BV_DRAIN = 500V, Rdson \u2248 20\u03a9). Also supplies VDD via internal JFET/startup circuit charging the VDD cap."+        "description": "Drain of the internal high-voltage power MOSFET (BV_DRAIN = 500V, Rdson ≈ 20Ω). Also supplies VDD via internal JFET/startup circuit charging the VDD cap."       },       {         "number": "2",@@ -44,13 +44,13 @@         "number": "3",         "name": "FB",         "type": "input",-        "description": "Feedback input for constant-voltage control. Compared against VFB_CV \u2248 2V threshold; frequency-hopping regulator sets Vout via RFBL/(RFBL+RFBH) = VFB_CV/Vout. Abs max -0.3 to 7V."+        "description": "Feedback input for constant-voltage control. Compared against VFB_CV ≈ 2V threshold; frequency-hopping regulator sets Vout via RFBL/(RFBL+RFBH) = VFB_CV/Vout. Abs max -0.3 to 7V."       },       {         "number": "4",         "name": "VDD",         "type": "power_in",-        "description": "Chip supply rail, typically 6.0V (abs max -0.3 to 7V). Bypassed with a local cap; charged from DRAIN via internal startup/regulator. IDD \u2248 450\u00b5A."+        "description": "Chip supply rail, typically 6.0V (abs max -0.3 to 7V). Bypassed with a local cap; charged from DRAIN via internal startup/regulator. IDD ≈ 450µA."       },       {         "number": "5",@@ -68,13 +68,13 @@         "number": "7",         "name": "GND",         "type": "power_in",-        "description": "Chip ground. Tie to pin 8; recommend \u22658\u00d78mm copper pour on pins 7/8 for thermal dissipation."+        "description": "Chip ground. Tie to pin 8; recommend ≥8×8mm copper pour on pins 7/8 for thermal dissipation."       },       {         "number": "8",         "name": "GND",         "type": "power_in",-        "description": "Chip ground. Tie to pin 7; recommend \u22658\u00d78mm copper pour on pins 7/8 for thermal dissipation."+        "description": "Chip ground. Tie to pin 7; recommend ≥8×8mm copper pour on pins 7/8 for thermal dissipation."       }     ],     "provenance": {@@ -138,5 +138,8 @@     "docs/sm7035p-datasheet.pdf",     "viewers/symbol.html",     "viewers/footprint.html"-  ]+  ],+  "visibility": {+    "public": true+  } }\ No newline at end of file