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Set visibility: public

Ray ·fffa2ce303 ·2mo ago ·parent 17c4583
1 file changed +8−5
page.json+8−5
@@ -32,25 +32,25 @@         "number": "1",         "name": "G",         "type": "input",-        "description": "Gate. Insulated gate input controlling the MOSFET channel. VGS absolute maximum \u00b120 V; typical gate threshold VGS(th) = 2.0 V (1.0-3.0 V). Total gate charge Qg \u2248 11 nC at VGS = 10 V."+        "description": "Gate. Insulated gate input controlling the MOSFET channel. VGS absolute maximum ±20 V; typical gate threshold VGS(th) = 2.0 V (1.0-3.0 V). Total gate charge Qg ≈ 11 nC at VGS = 10 V."       },       {         "number": "2",         "name": "D",         "type": "passive",-        "description": "Drain. High-side power terminal of the N-channel MOSFET. Rated V(BR)DSS = 60 V, continuous ID = 45 A (TC = 25 \u00b0C). Electrically connected to the exposed tab (pin 4) of the TO-252 package."+        "description": "Drain. High-side power terminal of the N-channel MOSFET. Rated V(BR)DSS = 60 V, continuous ID = 45 A (TC = 25 °C). Electrically connected to the exposed tab (pin 4) of the TO-252 package."       },       {         "number": "3",         "name": "S",         "type": "passive",-        "description": "Source. Low-side power terminal of the N-channel MOSFET. Continuous source (body-diode) current IS = 23 A; diode forward voltage VSD \u2248 1.0 V typical at IF = 15 A."+        "description": "Source. Low-side power terminal of the N-channel MOSFET. Continuous source (body-diode) current IS = 23 A; diode forward voltage VSD ≈ 1.0 V typical at IF = 15 A."       },       {         "number": "4",         "name": "D (TAB)",         "type": "passive",-        "description": "Drain tab. Exposed metal pad on the back of the TO-252 package used for PCB heat-sinking; internally connected to the Drain (pin 2). Solder to a copper pour for thermal dissipation (RthJC = 3.2 \u00b0C/W typical)."+        "description": "Drain tab. Exposed metal pad on the back of the TO-252 package used for PCB heat-sinking; internally connected to the Drain (pin 2). Solder to a copper pour for thermal dissipation (RthJC = 3.2 °C/W typical)."       }     ],     "provenance": {@@ -120,5 +120,8 @@     "docs/nvd5414nt4g-vb-datasheet.pdf",     "viewers/symbol.html",     "viewers/footprint.html"-  ]+  ],+  "visibility": {+    "public": true+  } }\ No newline at end of file