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NTH4L025N065SC1
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onsemi Silicon Carbide Field Effect Transistor (MOSFET), TO-247-4L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.md+95docs/hero.pngdocs/nth4l025n065sc1-datasheet.pdf+3325nth4l025n065sc1-etched.glbnth4l025n065sc1-hero.glbnth4l025n065sc1-hero.overlay.json+177nth4l025n065sc1.glbnth4l025n065sc1.kicad_mod+209nth4l025n065sc1.kicad_sym+29nth4l025n065sc1.lbr+115nth4l025n065sc1.step+3006package.json+172page.json+178viewers/footprint.html+1viewers/symbol.html+1README.mdadded+95@@ -0,0 +1,95 @@+# NTH4L025N065SC1++**onsemi** · Silicon Carbide Field Effect Transistor (MOSFET) · TO-247-4L++NTH4L025N065SC1 from onsemi, in a TO-247-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | D | passive | Drain of the N-channel SiC MOSFET, rated 650 V drain-to-source (VDSS) and 99 A continuous at TC = 25°C. |+| 2 | S2 | passive | Power Source, the main source current path, with body-diode source current rated 75 A. |+| 3 | S1 | passive | Kelvin Source, the source sense connection for the gate drive return. |+| 4 | G | input | Gate, with an absolute maximum of -8/+22 V and a recommended operating range of -5/+18 V relative to source. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | onsemi |+| Package | TO-247-4L |+| Category | Silicon Carbide (SiC) Devices |+| Pins | 4 |++## Electrical characteristics++Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).++| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |+|---|---|---|---|---|---|---|---|+| Drain-to-Source Breakdown Voltage | V(BR)DSS | 650 | | | V | VGS = 0 V, ID = 1 mA | 2 |+| Zero Gate Voltage Drain Current | IDSS | | | 10 | µA | VGS = 0 V, VDS = 650 V, TJ = 25°C | 2 |+| Zero Gate Voltage Drain Current | IDSS | | | 1 | mA | VGS = 0 V, VDS = 650 V, TJ = 175°C | 2 |+| Gate-to-Source Leakage Current | IGSS | | | 250 | nA | VGS = +18/-5 V, VDS = 0 V | 2 |+| Gate Threshold Voltage | VGS(TH) | 1.8 | 2.8 | 4.3 | V | VGS = VDS, ID = 15.5 mA | 2 |+| Recommended Gate Voltage | VGOP | -5 | | 18 | V | | 2 |+| Drain-to-Source On Resistance | RDS(on) | | 19 | 28.5 | mΩ | VGS = 18 V, ID = 45 A, TJ = 25°C | 2 |+| Continuous Drain-Source Diode Forward Current | ISD | | | 75 | A | VGS = -5 V, TJ = 25°C | 2 |+| Pulsed Drain-Source Diode Forward Current | ISDM | | | 323 | A | VGS = -5 V, TJ = 25°C | 2 |+| Drain-to-Source Voltage | VDSS | | | 650 | V | TJ = 25°C | 1 |+| Gate-to-Source Voltage | VGS | -8 | | 22 | V | TJ = 25°C | 1 |+| Recommended Gate-to-Source Voltage | VGSop | -5 | | 18 | V | TC < 175°C | 1 |+| Continuous Drain Current | ID | | | 99 | A | Steady State, TC = 25°C | 1 |+| Power Dissipation | PD | | | 348 | W | TC = 25°C | 1 |+| Continuous Drain Current | ID | | | 70 | A | Steady State, TC = 100°C | 1 |+| Power Dissipation | PD | | | 174 | W | TC = 100°C | 1 |+| Pulsed Drain Current | IDM | | | 323 | A | TC = 25°C | 1 |+| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 175 | °C | | 1 |+| Source Current (Body Diode) | IS | | | 75 | A | | 1 |+| Single Pulse Drain-to-Source Avalanche Energy | EAS | | | 62 | mJ | IL(pk) = 11.2 A, L = 1 mH | 1 |+| Maximum Lead Temperature for Soldering | TL | | | 260 | °C | 1/8" from case for 5 s | 1 |+| Junction-to-Case Thermal Resistance | RθJC | | | 0.43 | °C/W | Steady State | 2 |+| Junction-to-Ambient Thermal Resistance | RθJA | | | 40 | °C/W | Steady State | 2 |+| Drain-to-Source Breakdown Voltage Temperature Coefficient | V(BR)DSS/TJ | | 0.15 | | V/°C | ID = 20 mA, referenced to 25°C | 2 |+| Drain-to-Source On Resistance | RDS(on) | | 25 | | mΩ | VGS = 15 V, ID = 45 A, TJ = 25°C | 2 |+| Drain-to-Source On Resistance | RDS(on) | | 24 | | mΩ | VGS = 18 V, ID = 45 A, TJ = 175°C | 2 |+| Forward Transconductance | gFS | | 27 | | S | VDS = 10 V, ID = 45 A | 2 |+| Input Capacitance | CISS | | 3480 | | pF | VGS = 0 V, f = 1 MHz, VDS = 325 V | 2 |+| Output Capacitance | COSS | | 278 | | pF | VGS = 0 V, f = 1 MHz, VDS = 325 V | 2 |+| Reverse Transfer Capacitance | CRSS | | 25 | | pF | VGS = 0 V, f = 1 MHz, VDS = 325 V | 2 |+| Total Gate Charge | QG(TOT) | | 164 | | nC | VGS = -5/18 V, VDS = 520 V, ID = 45 A | 2 |+| Gate-to-Source Charge | QGS | | 48 | | nC | VGS = -5/18 V, VDS = 520 V, ID = 45 A | 2 |+| Gate-to-Drain Charge | QGD | | 48 | | nC | VGS = -5/18 V, VDS = 520 V, ID = 45 A | 2 |+| Gate Resistance | RG | | 1.5 | | Ω | f = 1 MHz | 2 |+| Turn-On Delay Time | td(ON) | | 17 | | ns | VGS = -5/18 V, VDS = 400 V, ID = 45 A, RG = 2.2 Ω, inductive load | 2 |+| Rise Time | tr | | 19 | | ns | VGS = -5/18 V, VDS = 400 V, ID = 45 A, RG = 2.2 Ω, inductive load | 2 |+| Turn-Off Delay Time | td(OFF) | | 32 | | ns | VGS = -5/18 V, VDS = 400 V, ID = 45 A, RG = 2.2 Ω, inductive load | 2 |+| Fall Time | tf | | 8 | | ns | VGS = -5/18 V, VDS = 400 V, ID = 45 A, RG = 2.2 Ω, inductive load | 2 |+| Turn-On Switching Loss | EON | | 93 | | µJ | VGS = -5/18 V, VDS = 400 V, ID = 45 A, RG = 2.2 Ω, inductive load | 2 |+| Turn-Off Switching Loss | EOFF | | 84 | | µJ | VGS = -5/18 V, VDS = 400 V, ID = 45 A, RG = 2.2 Ω, inductive load | 2 |+| Total Switching Loss | Etot | | 177 | | µJ | VGS = -5/18 V, VDS = 400 V, ID = 45 A, RG = 2.2 Ω, inductive load | 2 |+| Forward Diode Voltage | VSD | | 4.7 | | V | VGS = -5 V, ISD = 45 A, TJ = 25°C | 2 |+| Reverse Recovery Time | tRR | | 25 | | ns | VGS = -5/18 V, ISD = 45 A, dIS/dt = 1000 A/µs | 3 |+| Reverse Recovery Charge | QRR | | 171 | | nC | VGS = -5/18 V, ISD = 45 A, dIS/dt = 1000 A/µs | 3 |+| Reverse Recovery Energy | EREC | | 15.8 | | µJ | VGS = -5/18 V, ISD = 45 A, dIS/dt = 1000 A/µs | 3 |+| Peak Reverse Recovery Current | IRRM | | 13.7 | | A | VGS = -5/18 V, ISD = 45 A, dIS/dt = 1000 A/µs | 3 |+| Charge Time | Ta | | 14.9 | | ns | VGS = -5/18 V, ISD = 45 A, dIS/dt = 1000 A/µs | 3 |+| Discharge Time | Tb | | 10.6 | | ns | VGS = -5/18 V, ISD = 45 A, dIS/dt = 1000 A/µs | 3 |++## CAD (KiCad official)++- Symbol: `NTH4L025N065SC1`+- Footprint: `Package_TO_SOT_THT:TO-247-4_Vertical`+- 3D model: TO-247-4L (KiCad packages3D, STEP)+- 3D model files: `nth4l025n065sc1-etched.step` / `nth4l025n065sc1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `nth4l025n065sc1.step` / `nth4l025n065sc1.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/nth4l025n065sc1-d.pdf) (8 pp, sha256 `5371a9c481a764be`, retrieved 2026-10-31, tier: manufacturer)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/nth4l025n065sc1-datasheet.pdf)
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• Typ. RDS(on) = 19 m @ VGS = 18 V
Typ. RDS(on) = 25 m @ VGS = 15 V
• Ultra Low Gate Charge (QG(tot) = 164 nC)
• Low Capacitance (Coss = 278 pF)
• 100% Avalanche Tested
• TJ = 175°C
• This Device is Halide Free and RoHS Compliant with exemption 7a,
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