component
NCP6324BMTAATBG
Public Made by Adomby adom
onsemi DC-DC Converters, WDFN-8(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.md+90docs/hero.pngdocs/ncp6324bmtaatbg-datasheet.pdf+5920ncp6324bmtaatbg-etched.glbncp6324bmtaatbg-hero.glbncp6324bmtaatbg-hero.overlay.json+273ncp6324bmtaatbg.glbncp6324bmtaatbg.kicad_mod+295ncp6324bmtaatbg.kicad_sym+49ncp6324bmtaatbg.lbr+129ncp6324bmtaatbg.step+4784package.json+201page.json+207viewers/footprint.html+1viewers/symbol.html+1README.mdadded+90@@ -0,0 +1,90 @@+# NCP6324BMTAATBG++**onsemi** · DC-DC Converters · WDFN-8(2x2)++NCP6324BMTAATBG from onsemi, in a WDFN-8(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | PGND | power_in | Power ground for the power and analog blocks; must be connected to the system ground. |+| 2 | SW | power_out | Switch power pin that connects the power transistors to one end of the inductor. |+| 3 | AGND | power_in | Analog ground for the analog and digital blocks; must be connected to the system ground. |+| 4 | FB | input | Feedback input from the buck converter output to the error amplifier, connected to the resistor divider between the output and AGND. |+| 5 | EN | input | Enable input: a high level (above 1.1 V min) enables the device and a low level (below 0.4 V max) disables it. |+| 6 | PG/MODE | output | On the NCP6324B this is an open-drain Power Good output that is low when the output is not in power good and high-impedance when it is; it may be left unconnected when unused. |+| 7 | AVIN | power_in | Analog and digital supply input for the device (2.5 V to 5.5 V); an optional 1 µF or larger ceramic capacitor should be placed as close as possible to this pin. |+| 8 | PVIN | power_in | Power supply input for the device (2.5 V to 5.5 V); a 10 µF or larger ceramic capacitor must bypass this pin to ground, placed as close as possible. |+| 9 | PAD | passive | Exposed pad that must be soldered to system ground to achieve the specified power dissipation; the datasheet states it is internally unconnected. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | onsemi |+| Package | WDFN-8(2x2) |+| Category | Power Management (PMIC) |+| Pins | 9 |++## Electrical characteristics++Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).++| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |+|---|---|---|---|---|---|---|---|+| Analog Pins DC non switching (AVIN, PG, FB, EN) | VA-DC | -0.3 | | 6 | V | DC non switching: AVIN, PG, FB, EN | 4 |+| Power Pins DC non switching (PVIN, SW) | VP-DC | -0.3 | | 6 | V | DC non switching: PVIN, SW | 4 |+| Between PVIN, PGND pins transient | VP-TR | -0.3 | | 7.5 | V | transient 3 ns - 3 MHz | 4 |+| Human Body Model (HBM) ESD Rating | ESD HBM | | | 2000 | V | Note 1 | 4 |+| Machine Model (MM) ESD Rating | ESD MM | | | 200 | V | Note 1 | 4 |+| Latchup Current | ILU | -100 | | 100 | mA | Note 2 | 4 |+| Junction Temperature Range | TJMAX | -40 | | | °C | Note 3 | 4 |+| Storage Temperature Range | TSTG | -55 | | 150 | °C | | 4 |+| Thermal Resistance Junction-to-Top Case | RJC | | | 12 | °C/W | Note 4 | 4 |+| Thermal Resistance Junction-to-Board | RJB | | | 30 | °C/W | Note 4 | 4 |+| Thermal Resistance Junction-to-Ambient | RJA | | | 62 | °C/W | Note 4 | 4 |+| Power Dissipation | PD | | | 1.6 | W | Note 5 | 4 |+| Analog Input Supply | AVINR | 2.5 | | 5.5 | V | | 4 |+| Power Input Supply | PVINR | 2.5 | | 5.5 | V | | 4 |+| Operating Junction Temperature Range | TJ | -40 | | 125 | °C | Note 7 | 4 |+| Inductor for DC to DC Converter | LOUT | 0.67 | 1 | | µH | Note 8 | 4 |+| Output Capacitor | COUT | 7 | 10 | | µF | Notes 8, 9 | 4 |+| Input Capacitor for Power Supply | CPVIN | 7 | 10 | | µF | Note 8 | 4 |+| VIN Input Voltage Range | VIN | 2.5 | | 5.5 | V | VIN Range (Note 13) | 5 |+| VIN Shutdown Current | ISD | | | 1 | µA | EN low (Note 12 for NCP6324) | 5 |+| Output Voltage Range | VOUT | 0.6 | | | V | Note 10 | 5 |+| FB Voltage | VFB | 594 | 600 | 606 | mV | PWM Mode | 5 |+| Output Current Capability | IOUTMAX | 2 | | | A | Note 10 | 5 |+| Output Peak Current Limit P-Channel | ILIMP | 2.3 | 2.8 | 3.3 | A | P-Channel | 5 |+| VIN UVLO Falling Threshold | VINUV- | | | 2.4 | V | | 5 |+| VIN UVLO Hysteresis | VINHYS | 60 | 140 | 200 | mV | | 5 |+| Power Good Low Threshold | VPGL | 87 | 90 | 92 | % | VOUT falls down to cross the threshold (percentage of FB voltage) (Note 11) | 5 |+| Power Good Hysteresis | VPGHYS | 0 | 5 | 7 | % | VOUT rises up to cross the threshold (percentage of Power Good Low Threshold (VPGL) voltage) (Note 11) | 5 |+| Power Good Pin Low Voltage | VPG_L | | | 0.3 | V | Voltage at PG pin with 5 mA sink current (Note 11) | 5 |+| Power Good Pin Leakage Current | PG_LK | | | 100 | nA | 3.6 V at PG pin when power good valid (Note 11) | 5 |+| High-Side MOSFET ON Resistance | RON_H | | 160 | 200 | mΩ | VIN = 3.6 V (Note 12 for NCP6324) | 5 |+| Low-Side MOSFET ON Resistance | RON_L | | 110 | 140 | mΩ | VIN = 3.6 V (Note 12 for NCP6324) | 5 |+| Normal Operation Frequency | FSW | 2.7 | 3 | 3.3 | MHz | | 6 |+| Start Time | TSTART | 0 | 0.18 | 1 | ms | Time from EN to 90% of output voltage target | 6 |+| EN Input High Voltage | VEN_H | 1.1 | | | V | | 6 |+| EN Input Low Voltage | VEN_L | | | 0.4 | V | | 6 |+| EN Input Bias Current | IEN_BIAS | 0.1 | | 1 | µA | | 6 |+| Internal Output Discharge Resistance from SW to PGND | R_DIS | 75 | 500 | 700 | Ω | | 6 |++## CAD (KiCad official)++- Symbol: `NCP6324BMTAATBG`+- Footprint: `Package_DFN_QFN:WDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm`+- 3D model: WDFN-8(2x2) (KiCad packages3D, STEP)+- 3D model files: `ncp6324bmtaatbg-etched.step` / `ncp6324bmtaatbg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ncp6324bmtaatbg.step` / `ncp6324bmtaatbg.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590163809802891264) (17 pp, sha256 `6827ebbff39b39c4`, retrieved 2026-10-20, tier: lcsc)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/ncp6324bmtaatbg-datasheet.pdf)
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