NCP1117DTARKG

@@ -57,6 +57,18 @@   <smd name="1" x="-5.0400" y="2.2800" dx="2.2000" dy="1.2000" layer="1"/>   <smd name="2" x="1.2600" y="-0.0000" dx="6.4000" dy="5.8000" layer="1"/>   <smd name="3" x="-5.0400" y="-2.2800" dx="2.2000" dy="1.2000" layer="1"/>+  <polygon width="0.1200" layer="21">+    <vertex x="-5.0400" y="3.1400"/>+    <vertex x="-5.3800" y="3.6100"/>+    <vertex x="-4.7000" y="3.6100"/>+  </polygon>+  <polygon width="0.1000" layer="51">+    <vertex x="3.1100" y="3.2500"/>+    <vertex x="3.1100" y="-3.2500"/>+    <vertex x="-3.1100" y="-3.2500"/>+    <vertex x="-3.1100" y="2.2500"/>+    <vertex x="-2.1100" y="3.2500"/>+  </polygon>   <wire x1="-3.3100" y1="3.4500" x2="-3.3100" y2="3.1800" width="0.1200" layer="21"/>   <wire x1="-3.3100" y1="-3.4500" x2="-3.3100" y2="-3.1800" width="0.1200" layer="21"/>   <wire x1="3.1100" y1="3.4500" x2="-3.3100" y2="3.4500" width="0.1200" layer="21"/>@@ -72,7 +84,7 @@   <wire x1="4.1100" y1="-2.7000" x2="3.1100" y2="-2.7000" width="0.1000" layer="51"/>   <text x="0" y="4.050" size="1.27" layer="25" align="bottom-center">&gt;NAME</text>   <text x="0" y="-4.050" size="1.27" layer="27" align="top-center">&gt;VALUE</text>-<!--adom-pin1--><polygon width="0.0500" layer="21"><vertex x="-5.0400" y="3.1400"/><vertex x="-5.3800" y="3.6100"/><vertex x="-4.7000" y="3.6100"/></polygon></package>+</package> </packages> <symbols> <symbol name="NCP1117DTARKG">@@ -100,7 +112,13 @@         <connect gate="G$1" pin="Output" pad="2"/>         <connect gate="G$1" pin="Input" pad="3"/>       </connects>-      <technologies><technology name=""/></technologies>+      <technologies>+        <technology name="">+          <attribute name="MPN" value="NCP1117DTARKG" constant="no"/>+          <attribute name="MANUFACTURER" value="onsemi" constant="no"/>+          <attribute name="LCSC_PN" value="C233409" constant="no"/>+        </technology>+      </technologies>     </device>   </devices> </deviceset>

@@ -26,31 +26,33 @@       "model_3d_step": "ncp1117dtarkg.step",       "lbr": "ncp1117dtarkg.lbr"     },-    "distributor_links": {},+    "distributor_links": {+      "lcsc": "C233409"+    },     "pins": [       {         "number": "1",         "name": "Adjust/Ground",         "type": "input",-        "description": "For fixed-output variants (e.g. XT285 for 2.85 V, XT33 for 3.3 V, XT50 for 5.0 V, XT12 for 12 V), this is the Ground return pin. For the adjustable variant (XTA), this is the Adjust pin - feedback node with a 1.25 V reference (Vref = 1.238-1.262 V) and an adjust-pin current of ~52 μA (max 120 μA); output = Vref × (1 + R2/R1) + Iadj × R2."+        "description": "For fixed-output variants (e.g. XT285 for 2.85 V, XT33 for 3.3 V, XT50 for 5.0 V, XT12 for 12 V), this is the Ground return pin. For the adjustable variant (XTA), this is the Adjust pin - feedback node with a 1.25 V reference (Vref = 1.238-1.262 V) and an adjust-pin current of ~52 \u03bcA (max 120 \u03bcA); output = Vref \u00d7 (1 + R2/R1) + Iadj \u00d7 R2."       },       {         "number": "2",         "name": "Output",         "type": "power_out",-        "description": "Regulated positive output. Sources up to 1.0 A (typical current limit 1.5 A, min 1.0 A, max 2.2 A). Requires a 10 μF output capacitor for stability. The DPAK heatsink tab is internally connected to this Output pin (pin 2)."+        "description": "Regulated positive output. Sources up to 1.0 A (typical current limit 1.5 A, min 1.0 A, max 2.2 A). Requires a 10 \u03bcF output capacitor for stability. The DPAK heatsink tab is internally connected to this Output pin (pin 2)."       },       {         "number": "3",         "name": "Input",         "type": "power_in",-        "description": "Unregulated positive input supply, up to 20 V maximum (Vin abs max = 20 V). Requires a 10 μF input capacitor. Output current must not exceed 1.0 A when Vin > 12 V. Dropout voltage typically 0.95 V at 100 mA, 1.07 V at 800 mA."+        "description": "Unregulated positive input supply, up to 20 V maximum (Vin abs max = 20 V). Requires a 10 \u03bcF input capacitor. Output current must not exceed 1.0 A when Vin > 12 V. Dropout voltage typically 0.95 V at 100 mA, 1.07 V at 800 mA."       },       {         "number": "TAB",         "name": "Tab",         "type": "power_out",-        "description": "Thermal heatsink tab, internally connected to pin 2 (Output). Used for heat dissipation to the PCB copper pour; θJA = 67 °C/W (min-size pad), θJC = 6.0 °C/W for the DPAK package."+        "description": "Thermal heatsink tab, internally connected to pin 2 (Output). Used for heat dissipation to the PCB copper pour; \u03b8JA = 67 \u00b0C/W (min-size pad), \u03b8JC = 6.0 \u00b0C/W for the DPAK package."       }     ],     "provenance": {