component
MC14001BDG
Public Made by Adomby adom
onsemi Gates, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.md+99docs/hero.pngdocs/mc14001bdg-datasheet.pdf+5711mc14001bdg-etched.glbmc14001bdg-hero.glbmc14001bdg-hero.overlay.json+392mc14001bdg.glbmc14001bdg.kicad_mod+336mc14001bdg.kicad_sym+69mc14001bdg.lbr+148mc14001bdg.step+4824package.json+229page.json+235viewers/footprint.html+1viewers/symbol.html+1README.mdadded+99@@ -0,0 +1,99 @@+# MC14001BDG++**onsemi** · Gates · SOIC-14++MC14001BDG from onsemi, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | IN 1A | input | Input 1 of NOR gate A; input range VSS to VDD, and an unused input must be tied to VSS. |+| 2 | IN 2A | input | Input 2 of NOR gate A; input range VSS to VDD, and an unused input must be tied to VSS. |+| 3 | OUTA | output | Buffered output of NOR gate A; maximum ±10 mA per pin. |+| 4 | OUTB | output | Buffered output of NOR gate B; maximum ±10 mA per pin. |+| 5 | IN 2B | input | Input 2 of NOR gate B; input range VSS to VDD, and an unused input must be tied to VSS. |+| 6 | IN 1B | input | Input 1 of NOR gate B; input range VSS to VDD, and an unused input must be tied to VSS. |+| 7 | VSS | power_in | Ground/negative supply reference (VSS) for all voltages. |+| 8 | IN 1C | input | Input 1 of NOR gate C; input range VSS to VDD, and an unused input must be tied to VSS. |+| 9 | IN 2C | input | Input 2 of NOR gate C; input range VSS to VDD, and an unused input must be tied to VSS. |+| 10 | OUTC | output | Buffered output of NOR gate C; maximum ±10 mA per pin. |+| 11 | OUTD | output | Buffered output of NOR gate D; maximum ±10 mA per pin. |+| 12 | IN 2D | input | Input 2 of NOR gate D; input range VSS to VDD, and an unused input must be tied to VSS. |+| 13 | IN 1D | input | Input 1 of NOR gate D; input range VSS to VDD, and an unused input must be tied to VSS. |+| 14 | VDD | power_in | Positive supply voltage, 3.0 Vdc to 18 Vdc (absolute maximum −0.5 to +18.0 V). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | onsemi |+| Package | SOIC-14 |+| Category | Logic ICs |+| Pins | 14 |++## Electrical characteristics++Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).++| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |+|---|---|---|---|---|---|---|---|+| DC Supply Voltage Range | VDD | -0.5 | | 18 | V | Referenced to VSS | 1 |+| Input or Output Voltage Range | Vin, Vout | -0.5 | | | V | DC or transient; max is VDD + 0.5 | 1 |+| Input or Output Current per Pin | Iin, Iout | -10 | | 10 | mA | DC or transient, per pin | 1 |+| Power Dissipation per Package | PD | | | 500 | mW | Derate -7.0 mW/°C from 65 °C to 125 °C (D package) | 1 |+| Ambient Temperature Range | TA | -55 | | 125 | °C | | 1 |+| Storage Temperature Range | Tstg | -65 | | 150 | °C | | 1 |+| Lead Temperature | TL | | | 260 | °C | 8-second soldering | 1 |+| ESD Withstand Voltage HBM | VESD | 3000 | | | V | Human Body Model, > 3000 | 1 |+| ESD Withstand Voltage MM | VESD | 300 | | | V | Machine Model, > 300 | 1 |+| Supply Voltage Range | VDD | 3 | | 18 | Vdc | Features | 1 |+| Output Voltage 0 Level | VOL | | | 0.05 | Vdc | Vin = VDD or 0; VDD = 5.0, 10, 15 V; -55 °C | 3 |+| Output Voltage 0 Level | VOL | | 0 | 0.05 | Vdc | Vin = VDD or 0; VDD = 5.0, 10, 15 V; 25 °C | 3 |+| Output Voltage 1 Level | VOH | 4.95 | 5 | | Vdc | Vin = 0 or VDD; VDD = 5.0 V; min at -55, 25, 125 °C; typ at 25 °C | 3 |+| Output Voltage 1 Level | VOH | 9.95 | 10 | | Vdc | Vin = 0 or VDD; VDD = 10 V; min at -55, 25, 125 °C; typ at 25 °C | 3 |+| Output Voltage 1 Level | VOH | 14.95 | 15 | | Vdc | Vin = 0 or VDD; VDD = 15 V; min at -55, 25, 125 °C; typ at 25 °C | 3 |+| Input Voltage 0 Level | VIL | | 2.25 | 1.5 | Vdc | VO = 4.5 or 0.5 Vdc; VDD = 5.0 V; max at -55, 25, 125 °C; typ at 25 °C | 3 |+| Input Voltage 0 Level | VIL | | 4.5 | 3 | Vdc | VO = 9.0 or 1.0 Vdc; VDD = 10 V; max at -55, 25, 125 °C; typ at 25 °C | 3 |+| Input Voltage 0 Level | VIL | | 6.75 | 4 | Vdc | VO = 13.5 or 1.5 Vdc; VDD = 15 V; max at -55, 25, 125 °C; typ at 25 °C | 3 |+| Input Voltage 1 Level | VIH | 3.5 | 2.75 | | Vdc | VO = 0.5 or 4.5 Vdc; VDD = 5.0 V; min at -55, 25, 125 °C; typ at 25 °C | 3 |+| Input Voltage 1 Level | VIH | 7 | 5.5 | | Vdc | VO = 1.0 or 9.0 Vdc; VDD = 10 V; min at -55, 25, 125 °C; typ at 25 °C | 3 |+| Input Voltage 1 Level | VIH | 11 | 8.25 | | Vdc | VO = 1.5 or 13.5 Vdc; VDD = 15 V; min at -55, 25, 125 °C; typ at 25 °C | 3 |+| Output Drive Current Source | IOH | -3 | -4.2 | | mAdc | VOH = 2.5 Vdc; VDD = 5.0 V; min -55 °C; 25 °C min -2.4; 125 °C min -1.7 | 3 |+| Output Drive Current Source | IOH | -0.64 | -0.88 | | mAdc | VOH = 4.6 Vdc; VDD = 5.0 V; min -55 °C; 25 °C min -0.51; 125 °C min -0.36 | 3 |+| Output Drive Current Source | IOH | -1.6 | -2.25 | | mAdc | VOH = 9.5 Vdc; VDD = 10 V; min -55 °C; 25 °C min -1.3; 125 °C min -0.9 | 3 |+| Output Drive Current Source | IOH | -4.2 | -8.8 | | mAdc | VOH = 13.5 Vdc; VDD = 15 V; min -55 °C; 25 °C min -3.4; 125 °C min -2.4 | 3 |+| Output Drive Current Sink | IOL | 0.64 | 0.88 | | mAdc | VOL = 0.4 Vdc; VDD = 5.0 V; min -55 °C; 25 °C min 0.51; 125 °C min 0.36 | 3 |+| Output Drive Current Sink | IOL | 1.6 | 2.25 | | mAdc | VOL = 0.5 Vdc; VDD = 10 V; min -55 °C; 25 °C min 1.3; 125 °C min 0.9 | 3 |+| Output Drive Current Sink | IOL | 4.2 | 8.8 | | mAdc | VOL = 1.5 Vdc; VDD = 15 V; min -55 °C; 25 °C min 3.4; 125 °C min 2.4 | 3 |+| Input Current | Iin | -0.1 | | 0.1 | µAdc | VDD = 15 V; -55 °C (25 °C ±0.1, typ ±0.00001; 125 °C ±1.0) | 3 |+| Input Capacitance | Cin | | 5 | 7.5 | pF | Vin = 0; 25 °C | 3 |+| Quiescent Current (Per Package) | IDD | | 0.0005 | 0.25 | µAdc | VDD = 5.0 V; max at -55 and 25 °C; 125 °C max 7.5 | 3 |+| Quiescent Current (Per Package) | IDD | | 0.001 | 0.5 | µAdc | VDD = 10 V; max at -55 and 25 °C; 125 °C max 15 | 3 |+| Quiescent Current (Per Package) | IDD | | 0.0015 | 1 | µAdc | VDD = 15 V; max at -55 and 25 °C; 125 °C max 30 | 3 |+| Output Rise Time | tTLH | | 100 | 200 | ns | VDD = 5.0 V; CL = 50 pF, TA = 25 °C | 4 |+| Output Rise Time | tTLH | | 50 | 100 | ns | VDD = 10 V; CL = 50 pF, TA = 25 °C | 4 |+| Output Rise Time | tTLH | | 40 | 80 | ns | VDD = 15 V; CL = 50 pF, TA = 25 °C | 4 |+| Output Fall Time | tTHL | | 100 | 200 | ns | VDD = 5.0 V; CL = 50 pF, TA = 25 °C | 4 |+| Output Fall Time | tTHL | | 50 | 100 | ns | VDD = 10 V; CL = 50 pF, TA = 25 °C | 4 |+| Output Fall Time | tTHL | | 40 | 80 | ns | VDD = 15 V; CL = 50 pF, TA = 25 °C | 4 |+| Propagation Delay Time (MC14001B) | tPLH, tPHL | | 125 | 250 | ns | VDD = 5.0 V; CL = 50 pF, TA = 25 °C | 4 |+| Propagation Delay Time (MC14001B) | tPLH, tPHL | | 50 | 100 | ns | VDD = 10 V; CL = 50 pF, TA = 25 °C | 4 |+| Propagation Delay Time (MC14001B) | tPLH, tPHL | | 40 | 80 | ns | VDD = 15 V; CL = 50 pF, TA = 25 °C | 4 |++## CAD (KiCad official)++- Symbol: `MC14001BDG`+- Footprint: `Package_SO:SOIC-14_3.9x8.7mm_P1.27mm`+- 3D model: SOIC-14 (KiCad packages3D, STEP)+- 3D model files: `mc14001bdg-etched.step` / `mc14001bdg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mc14001bdg.step` / `mc14001bdg.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [onsemi datasheet](https://www.onsemi.com/pdf/datasheet/mc14001b-d.pdf) (14 pp, sha256 `c723c6af4f9e489a`, retrieved 2026-10-22, tier: manufacturer)+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/mc14001bdg-datasheet.pdf)
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