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Set visibility: public

Ray ·627cf7d418 ·2mo ago ·parent 5104160
1 file changed +11−8
page.json+11−8
@@ -32,7 +32,7 @@         "number": "1",         "name": "BST",         "type": "passive",-        "description": "Bootstrap capacitor pin providing the drive voltage (above VIN) for the internal top-side power NMOS switch. Place a 0.1\u00b5F ceramic capacitor from BST to SW as close to the IC as possible; do not place a series resistor."+        "description": "Bootstrap capacitor pin providing the drive voltage (above VIN) for the internal top-side power NMOS switch. Place a 0.1µF ceramic capacitor from BST to SW as close to the IC as possible; do not place a series resistor."       },       {         "number": "2",@@ -44,13 +44,13 @@         "number": "3",         "name": "INTVCC",         "type": "power_out",-        "description": "Internal 3.5V LDO regulator bypass pin that supplies the internal gate drivers and control circuits. Voltage varies from 2.8V to 3.5V; max output 20mA. Decouple to GND with at least a 1\u00b5F low-ESR ceramic capacitor. Do not load with external circuitry."+        "description": "Internal 3.5V LDO regulator bypass pin that supplies the internal gate drivers and control circuits. Voltage varies from 2.8V to 3.5V; max output 20mA. Decouple to GND with at least a 1µF low-ESR ceramic capacitor. Do not load with external circuitry."       },       {         "number": "4",         "name": "RT",         "type": "input",-        "description": "Oscillator frequency-set pin. Tie a resistor from RT to GND to program the switching frequency between 200kHz (RT = 221k\u03a9) and 2.2MHz (RT = 16.2k\u03a9)."+        "description": "Oscillator frequency-set pin. Tie a resistor from RT to GND to program the switching frequency between 200kHz (RT = 221kΩ) and 2.2MHz (RT = 16.2kΩ)."       },       {         "number": "5",@@ -68,13 +68,13 @@         "number": "7",         "name": "TR/SS",         "type": "input",-        "description": "Output tracking and soft-start pin. An internal 2\u00b5A pull-up from INTVCC charges an external capacitor to program the output-voltage slew rate. Below 0.782V the part regulates FB to the TR/SS voltage; above 0.782V tracking is disabled. Pulled to GND through a 300\u03a9 MOSFET in shutdown and fault conditions."+        "description": "Output tracking and soft-start pin. An internal 2µA pull-up from INTVCC charges an external capacitor to program the output-voltage slew rate. Below 0.782V the part regulates FB to the TR/SS voltage; above 0.782V tracking is disabled. Pulled to GND through a 300Ω MOSFET in shutdown and fault conditions."       },       {         "number": "8",         "name": "PG",         "type": "output",-        "description": "Power-good open-drain output. Held low until FB is within \u00b18.5% of the regulation setpoint and no fault is present. Absolute max 42V; valid when VIN > 3.2V regardless of EN/UV state. Requires an external pull-up resistor."+        "description": "Power-good open-drain output. Held low until FB is within ±8.5% of the regulation setpoint and no fault is present. Absolute max 42V; valid when VIN > 3.2V regardless of EN/UV state. Requires an external pull-up resistor."       },       {         "number": "9",@@ -86,13 +86,13 @@         "number": "10",         "name": "EN/UV",         "type": "input",-        "description": "Enable / input under-voltage lockout pin. Rising threshold 1.05V, falling 1.00V. Ground to shut the part down (IQ \u2248 1\u00b5A); tie to VIN if shutdown/UVLO is not used, or use an external VIN divider to program a precise VIN turn-on threshold. Absolute max 42V."+        "description": "Enable / input under-voltage lockout pin. Rising threshold 1.05V, falling 1.00V. Ground to shut the part down (IQ ≈ 1µA); tie to VIN if shutdown/UVLO is not used, or use an external VIN divider to program a precise VIN turn-on threshold. Absolute max 42V."       },       {         "number": "11",         "name": "GND",         "type": "power_in",-        "description": "Exposed thermal pad - signal and power ground return. Must be soldered directly to the PCB ground plane both for the electrical return path and to achieve the specified \u03b8JA = 40\u00b0C/W thermal resistance."+        "description": "Exposed thermal pad - signal and power ground return. Must be soldered directly to the PCB ground plane both for the electrical return path and to achieve the specified θJA = 40°C/W thermal resistance."       }     ],     "provenance": {@@ -222,5 +222,8 @@     "docs/lt8609aimse-pbf-datasheet.pdf",     "viewers/symbol.html",     "viewers/footprint.html"-  ]+  ],+  "visibility": {+    "public": true+  } }\ No newline at end of file