lm2575hvs-3-3: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain…
lm2575hvs-3-3: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
lm2575hvs-3-3: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
lm2575hvs-3-3: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
lm2575hvs-3-3: laser-etched CAD + chip hero (factory 2.0.0 backfill)
lm2575hvs-3-3: backfill missing artifacts (variants+12)
lm2575hvs-3-3: publish the laser-etched STEP alongside the bare one
rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an…
orderable attributes: rebuild .lbr with adom-lbr 2.18.0 so MPN, MANUFACTURER and the distributor part numbers reach <te…
add symbol pin "6" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no…
pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left)
pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left)
README: name the footprint the page actually ships (Package_TO_SOT_SMD:TO-263-2 -> Package_TO_SOT_SMD:TO-263-5_TabPin6)
fix footprint: TO-263-2 -> TO-263-5_TabPin6 (pad_count, 5 pins)
lm2575hvs-3-3: factory component page (tier=lcsc)
Initial commit: component/lm2575hvs-3-3