← Commit history

lm13700mx: backfill missing artifacts (variants)

Ray ·b0e90d3d49 · ·parent f414a19
2 files changed +17−1
README.md+2
@@ -36,6 +36,8 @@ LM13700MX from Texas Instruments TI, in a SOIC-16. Pinout and pin descriptions e  ## Ordering variants +Same part, different packaging or reel option.+ - `LM13700MXM` - `LM13700MX` - `LM13700MXN`
page.json+15−1
@@ -201,5 +201,19 @@   ],   "visibility": {     "public": true-  }+  },+  "variants": [+    {+      "mpn": "LM13700MXM",+      "kind": "packaging"+    },+    {+      "mpn": "LM13700MX",+      "kind": "packaging"+    },+    {+      "mpn": "LM13700MXN",+      "kind": "packaging"+    }+  ] }\ No newline at end of file