LGS63040EP

@@ -18,8 +18,32 @@   "derived_from": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e"  },  "pad_count": 9,+ "symbol_pins": [+  "1",+  "2",+  "3",+  "4",+  "5",+  "6",+  "7",+  "8"+ ],  "paste_apertures": 4,- "issues": [],+ "issues": [+  {+   "kind": "pin-not-in-symbol",+   "pin": "EP",+   "name": "GND",+   "detail": "page.json describes pin \"EP\" (GND) from the datasheet, but the symbol has no such pin, so nothing can connect to it"+  },+  {+   "kind": "pad-has-no-pin",+   "pad": "9",+   "thermal": true,+   "described_in_page": false,+   "detail": "footprint pad \"9\" is in copper but the SYMBOL has no pin for it - a thermal pad with no net will float"+  }+ ],  "pads": [   {    "pad": "1",@@ -276,15 +300,15 @@    ],    "layers": [],    "thermal": true,-   "pin": "EP",-   "name": "GND",-   "type": "power_in",-   "description": "Exposed thermal pad on package bottom, internally connected to GND. Must be soldered to the PCB ground plane for thermal dissipation (θJB ≈ 33.2°C/W, θJA ≈ 173°C/W).",+   "pin": "9",+   "name": null,+   "type": null,+   "description": null,    "is_pin1": false,    "source": {     "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",     "meaning": null,-    "correspondence": "derived: sole unmatched pin \"EP\" to sole thermal pad \"9\""+    "correspondence": "kicad: symbol pin number == pad name"    }   }  ]