component
JSM4056
Public Made by Adomby adom
JSMSEMI Battery Management, ESOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
add symbol pin "9" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no net (vendor string 'ESOP-8' denotes an exposed pad)
4 files changed
+30−13
jsm4056.kicad_sym+4@@ -40,6 +40,10 @@ (name "VBAT" (effects (font (size 1.27 1.27)))) (number "5" (effects (font (size 1.27 1.27)))) )+ (pin power_in line (at -17.78 -7.62 0) (length 5.08)+ (name "EXPOSED PAD" (effects (font (size 1.27 1.27))))+ (number "9" (effects (font (size 1.27 1.27))))+ ) ) ) )
jsm4056.lbr+2@@ -89,6 +89,7 @@ <pin name="CHRG" x="17.78" y="0" length="middle" direction="out" rot="R180"/> <pin name="STDBY" x="17.78" y="-2.54" length="middle" direction="out" rot="R180"/> <pin name="VBAT" x="17.78" y="-5.08" length="middle" direction="out" rot="R180"/>+ <pin name="EXPOSED PAD" x="-17.78" y="-7.62" length="middle" direction="pwr"/> </symbol> </symbols> <devicesets>@@ -108,6 +109,7 @@ <connect gate="G$1" pin="CHRG" pad="7"/> <connect gate="G$1" pin="STDBY" pad="6"/> <connect gate="G$1" pin="VBAT" pad="5"/>+ <connect gate="G$1" pin="EXPOSED PAD" pad="9"/> </connects> <technologies><technology name=""/></technologies> </device>
pads.json+16−12@@ -18,15 +18,19 @@ "derived_from": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e" }, "pad_count": 9,- "paste_apertures": 4,- "issues": [- {- "kind": "pad-has-no-pin",- "pad": "9",- "thermal": true,- "detail": "footprint pad \"9\" is in copper but no pin claims it - a thermal pad with no net will float"- }+ "symbol_pins": [+ "1",+ "2",+ "3",+ "4",+ "5",+ "6",+ "7",+ "8",+ "9" ],+ "paste_apertures": 4,+ "issues": [], "pads": [ { "pad": "1",@@ -284,13 +288,13 @@ "layers": [], "thermal": true, "pin": "9",- "name": null,- "type": null,- "description": null,+ "name": "EXPOSED PAD",+ "type": "power_in",+ "description": "Exposed thermal pad. Present in the package land pattern; connect it per the manufacturer datasheet thermal recommendation. Added because the footprint carries this pad and the symbol had no pin for it.", "is_pin1": false, "source": { "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",- "meaning": null,+ "meaning": "page.json:component.pins", "correspondence": "kicad: symbol pin number == pad name" } }
page.json+8−1@@ -15,7 +15,7 @@ "mpn": "JSM4056", "manufacturer": "JSMSEMI", "package": "ESOP-8",- "pin_count": 8,+ "pin_count": 9, "category": "PMIC", "subcategory": "Battery Management", "datasheet": "https://wmsc.lcsc.com/wmsc/upload/file/pdf/v2/lcsc/2401051646_JSMSEMI-JSM4056_C2848864.pdf",@@ -75,6 +75,13 @@ "name": "CE", "type": "input", "description": "Chip enable input (absolute max -0.3 to 8 V). Tie to VCC or leave floating for normal operation; tie to GND to shut the chip down."+ },+ {+ "number": "9",+ "name": "EXPOSED PAD",+ "type": "power_in",+ "description": "Exposed thermal pad. Present in the package land pattern; connect it per the manufacturer datasheet thermal recommendation. Added because the footprint carries this pad and the symbol had no pin for it.",+ "source": "derived-from-footprint" } ], "provenance": {