ISO1410BDWR

@@ -0,0 +1,56 @@+# ISO1410BDWR++**Texas Instruments** · RS-485/RS-422 ICs · SOIC-16-300mil++ISO1410BDWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VCC1 | power_in | Logic-side power supply. 1.71-1.89 V for 1.8-V operation, or 2.25-5.5 V for 2.5/3.3/5-V operation. Bypass to GND1 with a local decoupling capacitor. |+| 2 | GND1 | power_in | Ground connection for VCC1 (logic side). Must be tied to the same ground as pin 8 on the PCB. |+| 3 | R | output | Receiver output on the logic side. CMOS output that drives the MCU/FPGA RX pin at VCC1 levels. |+| 4 | RE | input | Receiver enable (active low). Drive low to enable the receiver output on R; drive high or leave open to disable/tri-state R. Referenced to VCC1/GND1 logic levels. |+| 5 | DE | input | Driver enable (active high). Drive high to enable the RS-485 bus driver outputs (A/B); low or open disables the driver, tri-stating the bus pins. |+| 6 | D | input | Driver input on the logic side. CMOS input from the MCU/FPGA TX pin; sampled at VCC1 logic levels when DE is asserted. |+| 7 | NC | unconnected | No internal connection. Device functionality is not affected if this pin is connected to supply or ground on the PCB. |+| 8 | GND1 | power_in | Ground connection for VCC1 (logic side). Must be tied together with pin 2 to GND1 on the PCB. |+| 9 | GND2 | power_in | Ground connection for VCC2 (bus side, isolated). Must be tied together with pin 15 to GND2 on the PCB. |+| 10 | NC | unconnected | No internal connection. Device functionality is not affected if this pin is connected to supply or ground on the PCB. |+| 11 | NC | unconnected | No internal connection. Device functionality is not affected if this pin is connected to supply or ground on the PCB. |+| 12 | A | bidirectional | RS-485 bus-side non-inverting I/O. Driver non-inverting output when DE is high; receiver non-inverting input when RE is low. Withstands −7 V to +12 V common-mode; ±18 V absolute max w.r.t. GND2. |+| 13 | B | bidirectional | RS-485 bus-side inverting I/O. Driver inverting output when DE is high; receiver inverting input when RE is low. Same common-mode and absolute-max range as A. |+| 14 | NC | unconnected | No internal connection. Device functionality is not affected if this pin is connected to supply or ground on the PCB. |+| 15 | GND2 | power_in | Ground connection for VCC2 (bus side, isolated). Must be tied together with pin 9 to GND2 on the PCB. |+| 16 | VCC2 | power_in | Transceiver-side (bus-side) power supply, 3.0-5.5 V. Isolated from VCC1 across the reinforced isolation barrier. Bypass to GND2 with a local decoupling capacitor. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | SOIC-16-300mil |+| Category | Comm/UART |+| Pins | 16 |++## Ordering variants++- `ISO1410BDWR`++## CAD (KiCad official)++- Symbol: `ISO1410BDWR`+- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`+- 3D model: SOIC-16-300mil (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/iso1410bdwr.pdf) (49 pp, sha256 `36c9ab5123938800`, retrieved 2026-08-17, tier: manufacturer)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/iso1410bdwr-datasheet.pdf)

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