component
ISL78301FVEAZ
Public Made by Adomby adom
RENESAS Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, HTSSOP-14. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
page.json+8−5@@ -38,7 +38,7 @@ "number": "2", "name": "IN", "type": "power_in",- "description": "Input supply pin. Recommended operating range +3V to +40V (absolute max +45V). A minimum 0.1\u00b5F ceramic input capacitor is required for proper operation."+ "description": "Input supply pin. Recommended operating range +3V to +40V (absolute max +45V). A minimum 0.1µF ceramic input capacitor is required for proper operation." }, { "number": "3",@@ -68,7 +68,7 @@ "number": "7", "name": "EN", "type": "input",- "description": "Enable input (40V tolerant TTL/CMOS logic). Drive HIGH (VEN_H = 1.485V typ) to enable the regulator; drive LOW (VEN_L = 0.975V typ) to place the device in shutdown mode (~2\u00b5A). Absolute max GND-0.3V to VCC; recommended 0V to +40V. Input current ~26nA typ."+ "description": "Enable input (40V tolerant TTL/CMOS logic). Drive HIGH (VEN_H = 1.485V typ) to enable the regulator; drive LOW (VEN_L = 0.975V typ) to place the device in shutdown mode (~2µA). Absolute max GND-0.3V to VCC; recommended 0V to +40V. Input current ~26nA typ." }, { "number": "8",@@ -110,13 +110,13 @@ "number": "14", "name": "OUT", "type": "power_out",- "description": "Regulated output. Fixed 3.3V \u00b11% on this FVEAZ variant, capable of 150mA. A 10\u00b5F ceramic output capacitor is required for stability; ground of COUT should return directly to pin 8 (GND). Internally protected by current limit (175mA min) and thermal shutdown (+165\u00b0C typ)."+ "description": "Regulated output. Fixed 3.3V ±1% on this FVEAZ variant, capable of 150mA. A 10µF ceramic output capacitor is required for stability; ground of COUT should return directly to pin 8 (GND). Internally protected by current limit (175mA min) and thermal shutdown (+165°C typ)." }, { "number": "15", "name": "EPAD", "type": "power_in",- "description": "Exposed thermal pad on the underside of the HTSSOP-14 package. Solder to the PCB GND copper plane for effective heat dissipation (\u03b8JC = 5\u00b0C/W; \u03b8JA scales with copper area, ~37\u00b0C/W typ)."+ "description": "Exposed thermal pad on the underside of the HTSSOP-14 package. Solder to the PCB GND copper plane for effective heat dissipation (θJC = 5°C/W; θJA scales with copper area, ~37°C/W typ)." } ], "provenance": {@@ -194,5 +194,8 @@ "docs/isl78301fveaz-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }