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symbol: bind pad 9 (GND), which had no pin. The footprint carries the pad and page.json described it as "EPAD", but no symbol pin resolved to it - so KiCad emitted no connection and the pad was inert copper in Fusion. On this part that pad is the thermal path. Name and type taken from the page's own entry; the entry is renumbered to the pad the footprint actually has, so page, symbol and footprint agree.

Ray ·ade571f198 · ·parent 590a086
4 files changed +30−36
ip2325.kicad_sym+4
@@ -40,6 +40,10 @@       (name "LED" (effects (font (size 1.27 1.27))))       (number "5" (effects (font (size 1.27 1.27))))     )+			(pin power_in line (at -17.78 -7.62 0) (length 5.08)+				(name "GND" (effects (font (size 1.27 1.27))))+				(number "9" (effects (font (size 1.27 1.27))))+			)     )   ) )
ip2325.lbr+18−15
@@ -50,18 +50,18 @@ <layer number="98" name="Guide" color="6" fill="1" visible="yes" active="yes"/> </layers> <library>-<description></description>+<description>INJOINIC DC-DC Converters, ESOP-8</description> <packages>-<package name="IP2325">-  <description>IP2325</description>-  <smd name="1" x="-2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="2" x="-2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="3" x="-2.4750" y="-0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="4" x="-2.4750" y="-1.9050" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="5" x="2.4750" y="-1.9050" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="6" x="2.4750" y="-0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="7" x="2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1"/>-  <smd name="8" x="2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1"/>+<package name="SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm">+  <description>SOIC-8-1EP, 3.9 x 4.9 mm, 1.27 mm pitch</description>+  <smd name="1" x="-2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>+  <smd name="2" x="-2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>+  <smd name="3" x="-2.4750" y="-0.6350" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>+  <smd name="4" x="-2.4750" y="-1.9050" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>+  <smd name="5" x="2.4750" y="-1.9050" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>+  <smd name="6" x="2.4750" y="-0.6350" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>+  <smd name="7" x="2.4750" y="0.6350" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>+  <smd name="8" x="2.4750" y="1.9050" dx="1.9500" dy="0.6000" layer="1" roundness="50"/>   <smd name="9" x="0.0000" y="-0.0000" dx="2.4100" dy="3.3000" layer="1"/>   <polygon width="0.1200" layer="21">     <vertex x="-2.6000" y="2.4700"/>@@ -87,12 +87,13 @@ </packages> <symbols> <symbol name="IP2325">+  <description>INJOINIC DC-DC Converters, ESOP-8</description>   <wire x1="-12.7" y1="5.08" x2="12.7" y2="5.08" width="0.254" layer="94"/>   <wire x1="12.7" y1="5.08" x2="12.7" y2="-7.62" width="0.254" layer="94"/>   <wire x1="12.7" y1="-7.62" x2="-12.7" y2="-7.62" width="0.254" layer="94"/>   <wire x1="-12.7" y1="-7.62" x2="-12.7" y2="5.08" width="0.254" layer="94"/>-  <text x="0" y="7.62" size="1.27" layer="95" align="bottom-center">&gt;NAME</text>-  <text x="0" y="-10.16" size="1.27" layer="96" align="top-center">&gt;VALUE</text>+  <text x="0.0000" y="7.6200" size="1.27" layer="95" align="center">&gt;NAME</text>+  <text x="0.0000" y="-10.1600" size="1.27" layer="96" align="center">&gt;VALUE</text>   <pin name="VSYS" x="-17.78" y="2.54" length="middle" direction="pwr"/>   <pin name="VOUT" x="-17.78" y="0" length="middle" direction="out"/>   <pin name="VSET" x="-17.78" y="-2.54" length="middle" direction="in"/>@@ -101,16 +102,17 @@   <pin name="BST" x="17.78" y="0" length="middle" direction="pas" rot="R180"/>   <pin name="VIN" x="17.78" y="-2.54" length="middle" direction="pwr" rot="R180"/>   <pin name="LED" x="17.78" y="-5.08" length="middle" direction="out" rot="R180"/>+  <pin name="GND" x="-17.78" y="-7.62" length="middle" direction="pwr"/> </symbol> </symbols> <devicesets> <deviceset name="IP2325" prefix="U">-  <description></description>+  <description>INJOINIC DC-DC Converters, ESOP-8</description>   <gates>     <gate name="G$1" symbol="IP2325" x="0" y="0"/>   </gates>   <devices>-    <device name="" package="IP2325">+    <device name="" package="SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm">       <connects>         <connect gate="G$1" pin="VSYS" pad="1"/>         <connect gate="G$1" pin="VOUT" pad="2"/>@@ -120,6 +122,7 @@         <connect gate="G$1" pin="BST" pad="7"/>         <connect gate="G$1" pin="VIN" pad="6"/>         <connect gate="G$1" pin="LED" pad="5"/>+        <connect gate="G$1" pin="GND" pad="9"/>       </connects>       <technologies>         <technology name="">
pads.json+7−20
@@ -26,24 +26,11 @@   "5",   "6",   "7",-  "8"+  "8",+  "9"  ],  "paste_apertures": 4,- "issues": [-  {-   "kind": "pin-not-in-symbol",-   "pin": "EPAD",-   "name": "GND",-   "detail": "page.json describes pin \"EPAD\" (GND) from the datasheet, but the symbol has no such pin, so nothing can connect to it"-  },-  {-   "kind": "pad-has-no-pin",-   "pad": "9",-   "thermal": true,-   "described_in_page": false,-   "detail": "footprint pad \"9\" is in copper but the SYMBOL has no pin for it - a thermal pad with no net will float"-  }- ],+ "issues": [],  "pads": [   {    "pad": "1",@@ -301,13 +288,13 @@    "layers": [],    "thermal": true,    "pin": "9",-   "name": null,-   "type": null,-   "description": null,+   "name": "GND",+   "type": "power_in",+   "description": "Exposed thermal pad and system/power ground. Solder to the PCB ground plane for thermal dissipation (θJA ≈ 60°C/W).",    "is_pin1": false,    "source": {     "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",-    "meaning": null,+    "meaning": "page.json:component.pins",     "correspondence": "kicad: symbol pin number == pad name"    }   }
page.json+1−1
@@ -79,7 +79,7 @@         "description": "DCDC switching node. Connects to the boost inductor (typ 2.2uH) at 500KHz switching frequency."       },       {-        "number": "EPAD",+        "number": "9",         "name": "GND",         "type": "power_in",         "description": "Exposed thermal pad and system/power ground. Solder to the PCB ground plane for thermal dissipation (\u03b8JA \u2248 60\u00b0C/W)."