component

HD3SS3212RKSR

Public Made by Adom

by adom

Texas Instruments Analog Switches - Special Purpose, TQFN-20-EP(2.5x4.5). KiCad symbol, footprint and 3D as used on Adom boards; pin functions from the manufacturer datasheet.

componentinterfacehd3ss3212rksrboard-derived

Verified HD3SS3212RKSR

by Claude, at Caleb Taylor's request · last 27 Oct 2026 · 1 record, 3 retired · files match
SymbolFootprint3D modelPins

Verification log 4 records

27 Oct 2026Claude, at Caleb Taylor's requestValidated against TI's HD3SS3212 datasheet (SLASE74F, revised September 2016)files match
SymbolFootprint3D modelPinsfor all variants
  • ✓Datasheet: the page already carries TI's current edition (SLASE74F, May 2015, revised September 2016; sha256 111def72b5f44bae matches ti.com/lit/ds/symlink/hd3ss3212.pdf fetched 2026-10-27); edition now recorded
  • ✓Pins 1-20 match the Pin Functions table (p.4-5) and the RKS 20-pin VQFN top view (p.4) by number; renamed to the datasheet's spelling: 2 OEN -> OEn (printed without an overbar), 3 A0P -> A0p, 4 A0N -> A0n, 7 A1P -> A1p, 8 A1N -> A1n, 12 C1N -> C1n, 13 C1P -> C1p, 14 C0N -> C0n, 15 C0P -> C0p, 16 B1N -> B1n, 17 B1P -> B1p, 18 B0N -> B0n, 19 B0P -> B0p; RSVD1, RSVD2, SEL, VCC (printed V with subscript CC), GND 5/11/20 unchanged
  • •Pin 21 is the exposed thermal pad, absent from the Pin Functions table: renamed PAD -> GND (power_in) because the design procedure says 'The thermal pad must be connected to ground' (p.14) and the package notes require it soldered to the PCB (p.20)
  • ✓Pin types agree with the table: VCC P and GND G -> power_in, OEn and SEL I -> input, high-speed ports I/O -> bidirectional, RSVD1/RSVD2 O -> output
  • ✓All 21 descriptions rewritten to the table wording (p.4-5) plus its footnote on the 20-kΩ pulldowns; pin 21 described from p.14 and p.20; earlier text cited p.4 for Vdiff/Vcm/VIH limits that are on p.5 and added a <20 µW figure not in the pin table
  • ✓Footprint vs RKS0020A (p.20-21): 21 pads, e = 0.50 mm; pin 1 on the top edge at the left (top view), 2-9 down the left side, 10/11 on the bottom edge, 12-19 up the right side, 20 top right, as the p.4 pinout; side pads 0.86 x 0.27 at x = ±1.185 (centres 2.37 apart vs TI's (2.3)), end pads at y = ±2.185 (4.37 vs TI's (4.3)); TI's example pads are 0.6 x 0.25, so these are longer and slightly wider and cover terminals b 0.2-0.3, L 0.3-0.5 at the 2.4-2.6 x 4.4-4.6 body edge; pad width 0.27 is under b max 0.30 (TI's own land is 0.25)
  • ✓Exposed pad 21 is 1.00 x 3.00 mm at the centre, equal to the drawing's exposed thermal pad 1 ±0.1 x 3 ±0.1 and TI's (1) x (3) land (p.20-21)
  • •3D body 2.50 x 4.50 x 0.80 mm against 2.4-2.6 x 4.4-4.6, 1 max (p.20); long axis along the footprint's y, pin-1 mark at the top-left end (matching GLB), seated on z = 0. The model is TI's generic RKS package model (source name LSF0108RKSR), not part-specific
  • ✓DigiKey 296-42174-2-ND (tape and reel; DigiKey product URL names HD3SS3212RKSR) and Mouser 595-HD3SS3212RKSR kept and added to specs; orderable HD3SS3212RKSR is the 0 to 70 °C RKS 20-pin part (p.4)
  • ✓Symbol and footprint Datasheet properties point at the manufacturer datasheet URL
  • ✓Symbol Datasheet / MPN / Manufacturer / DigiKey / Mouser / LCSC properties agree with page.json; footprint Datasheet property points at the manufacturer datasheet URL
  • ✓component-page-verify: all checks pass
Evidencedatasheet (Texas Instruments)
Verified files✓ hd3ss3212rksr.kicad_sym✓ hd3ss3212rksr.kicad_mod✓ hd3ss3212rksr.step
9 Oct 2026Claude (AI build)1 of 21 pins have no datasheet description yet (pins 21).superseded
reviewfor all variants
  • •1 of 21 pins have no datasheet description yet (pins 21).
9 Oct 2026Claude (AI build)The source 3D model is TI's generic RKS package model (named LSF0108RKSR); body dimensions...superseded
reviewfor all variants
  • •The source 3D model is TI's generic RKS package model (named LSF0108RKSR); body dimensions match the RKS package but it is not part-specific.
9 Oct 2026Claude (AI build)Automated build checks (awaiting human validation)superseded
SymbolFootprint3D modelPinsfor all variants
  • ✓Footprint extracted pad-for-pad from the source board and normalized to the footprint frame (back-side parts un-mirrored)
  • ✓3D model seated z=0 at footprint origin (placement inverse; method centroid-matched to KiCad library models on 59 cases)
  • ✓adom-lbr generate + lint passed
  • •20 of 21 pins described from the datasheet (adom-ds2sf, page-cited)
  • •Not yet checked by a person: land pattern vs datasheet, pin-1/orientation, 3D body vs drawing
Evidencedatasheet
Verified files! hd3ss3212rksr.kicad_sym! hd3ss3212rksr.kicad_mod✓ hd3ss3212rksr.step
Spot something wrong? Report it as an issue Propose a fix Records are signed by members of adom.
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
← Commit history

Use the English manufacturer datasheet

Caleb ·8e3e6bb70c ·21d ago ·parent 0fe37f5
5 files changed +54−79
README.md+21−21docs/hd3ss3212rksr-datasheet.pdfhd3ss3212rksr.kicad_sym+25−4hd3ss3212rksr.lbr+4−4verification.json+4−50
README.md+21−21
@@ -10,26 +10,26 @@ HD3SS3212RKSR from Texas Instruments, in a TQFN-20-EP(2.5x4.5). Symbol, footprin  | Pin | Name | Type | Function | |---|---|---|---|-| 1 | RSVD1 | output | _not yet described_ |-| 2 | OEN | input | Active-low chip enable. L: Normal operation. H: Shutdown. Input high voltage 2 V to VCC; input low voltage -0.1 V to 0.8 V. [datasheet p.3] |-| 3 | A0P | bidirectional | Port A, channel 0, high-speed positive signal. Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 4 | A0N | bidirectional | Port A, channel 0, high-speed negative signal. Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 5 | GND | power_in | Ground reference. [datasheet p.3] |-| 6 | VCC | power_in | 3.3-V power supply. Recommended operating range 3.0 to 3.6 V. Active current typ 0.6 mA, shutdown current typ 5 µA. [datasheet p.3] |-| 7 | A1P | bidirectional | Port A, channel 1, high-speed positive signal. Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 8 | A1N | bidirectional | Port A, channel 1, high-speed negative signal. Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 9 | SEL | input | Port select pin. Internally tied to GND via a 100-kΩ resistor. L: Port A to Port B. H: Port A to Port C. [datasheet p.3] |-| 10 | RSVD2 | output | _not yet described_ |-| 11 | GND | power_in | Ground reference. [datasheet p.3] |-| 12 | C1N | bidirectional | Port C, channel 1, high-speed negative signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 13 | C1P | bidirectional | Port C, channel 1, high-speed positive signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 14 | C0N | bidirectional | Port C, channel 0, high-speed negative signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 15 | C0P | bidirectional | Port C, channel 0, high-speed positive signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 16 | B1N | bidirectional | Port B, channel 1, high-speed negative signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 17 | B1P | bidirectional | Port B, channel 1, high-speed positive signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 18 | B0N | bidirectional | Port B, channel 0, high-speed negative signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 19 | B0P | bidirectional | Port B, channel 0, high-speed positive signal (connector side). Differential signaling up to 1.8 Vpp, common-mode 0-2 V. 20 kΩ internal pulldown switched in when port is not selected. [datasheet p.3] |-| 20 | GND | power_in | Ground reference. [datasheet p.3] |+| 1 | RSVD1 | output | Reserved. Can be left not connected or can be fed to VCC. [datasheet p.5] |+| 2 | OEN | input | Active-low chip enable. L: Normal operation. H: Shutdown (<20 µW). VIH ≥ 1.7 V, VIL ≤ 0.8 V. [datasheet p.4] |+| 3 | A0P | bidirectional | Port A, channel 0, high-speed positive differential signal. Vdiff up to 1.8 Vpp, Vcm 0 to 2 V. 20-kΩ pulldown switched in when port is not selected. [datasheet p.4] |+| 4 | A0N | bidirectional | Port A, channel 0, high-speed negative differential signal. Vdiff up to 1.8 Vpp, Vcm 0 to 2 V. 20-kΩ pulldown switched in when port is not selected. [datasheet p.4] |+| 5 | GND | power_in | Ground reference. [datasheet p.4] |+| 6 | VCC | power_in | 3.3-V power supply input. Recommended range 2.7 V to 3.6 V; absolute max 4 V. [datasheet p.4] |+| 7 | A1P | bidirectional | Port A, channel 1, high-speed positive differential signal. Vdiff up to 1.8 Vpp, Vcm 0 to 2 V. 20-kΩ pulldown switched in when port is not selected. [datasheet p.4] |+| 8 | A1N | bidirectional | Port A, channel 1, high-speed negative differential signal. Vdiff up to 1.8 Vpp, Vcm 0 to 2 V. 20-kΩ pulldown switched in when port is not selected. [datasheet p.4] |+| 9 | SEL | input | Port select pin. L: Port A to Port B. H: Port A to Port C. VIH ≥ 1.7 V, VIL ≤ 0.8 V. [datasheet p.4] |+| 10 | RSVD2 | output | Reserved. Can be left not connected or can be fed to VCC. [datasheet p.5] |+| 11 | GND | power_in | Ground reference. [datasheet p.4] |+| 12 | C1N | bidirectional | Port C, channel 1, high-speed negative differential signal (connector side). Routed to A1 pair when SEL = H. [datasheet p.4] |+| 13 | C1P | bidirectional | Port C, channel 1, high-speed positive differential signal (connector side). Routed to A1 pair when SEL = H. [datasheet p.4] |+| 14 | C0N | bidirectional | Port C, channel 0, high-speed negative differential signal (connector side). Routed to A0 pair when SEL = H. [datasheet p.4] |+| 15 | C0P | bidirectional | Port C, channel 0, high-speed positive differential signal (connector side). Routed to A0 pair when SEL = H. [datasheet p.4] |+| 16 | B1N | bidirectional | Port B, channel 1, high-speed negative differential signal (connector side). Routed to A1 pair when SEL = L. [datasheet p.4] |+| 17 | B1P | bidirectional | Port B, channel 1, high-speed positive differential signal (connector side). Routed to A1 pair when SEL = L. [datasheet p.4] |+| 18 | B0N | bidirectional | Port B, channel 0, high-speed negative differential signal (connector side). Routed to A0 pair when SEL = L. [datasheet p.4] |+| 19 | B0P | bidirectional | Port B, channel 0, high-speed positive differential signal (connector side). Routed to A0 pair when SEL = L. [datasheet p.5] |+| 20 | GND | power_in | Ground reference. [datasheet p.4] | | 21 | PAD | power_in | _not yet described_ |  ## Key specifications@@ -53,7 +53,7 @@ HD3SS3212RKSR from Texas Instruments, in a TQFN-20-EP(2.5x4.5). Symbol, footprin  ## Provenance -- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/hd3ss3212) (sha256 `8705f74edcc5c08b`, retrieved 2026-10-08, tier: lcsc)+- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/hd3ss3212.pdf) (sha256 `111def72b5f44bae`, retrieved 2026-10-08, tier: mfr) - **CAD:** Footprint, symbol and 3D model as used on Adom board designs; the 3D model was extracted from the board STEP export. - **Pins:** KiCad symbol from the source board + adom-ds2sf datasheet extraction (claude-opus-4-7).
docs/hd3ss3212rksr-datasheet.pdf
⋯ 1 unchanged line ⋯
hd3ss3212rksr.kicad_sym+25−4
@@ -18,7 +18,28 @@ 				(justify left bottom) 			) 		)-		(property "Manufacturer" "Texas Instruments" (at 0 0 0) (effects (font (size 1.27 1.27)) (hide yes))) (property "DigiKey" "296-42174-2-ND" (at 0 0 0) (effects (font (size 1.27 1.27)) (hide yes))) (property "Mouser" "595-HD3SS3212RKSR" (at 0 0 0) (effects (font (size 1.27 1.27)) (hide yes))) (property "Value" "HD3SS3212RKSR"+		(property "Manufacturer" "Texas Instruments"+			(at 0 0 0)+			(effects+				(font (size 1.27 1.27))+				(hide yes)+			)+		)+		(property "DigiKey" "296-42174-2-ND"+			(at 0 0 0)+			(effects+				(font (size 1.27 1.27))+				(hide yes)+			)+		)+		(property "Mouser" "595-HD3SS3212RKSR"+			(at 0 0 0)+			(effects+				(font (size 1.27 1.27))+				(hide yes)+			)+		)+		(property "Value" "HD3SS3212RKSR" 			(at -12.7 -39.56 0) 			(show_name no) 			(do_not_autoplace no)@@ -27,7 +48,7 @@ 				(justify left bottom) 			) 		)-		(property "Footprint" "Control Panel v2:HD3SS3212IRKSR_QFN50P450X250X100-21N"+		(property "Footprint" "mux_CDT:HD3SS3212IRKSR_QFN50P450X250X100-21N" 			(at 0 0 0) 			(show_name no) 			(do_not_autoplace no)@@ -37,7 +58,7 @@ 				(justify bottom) 			) 		)-		(property "Datasheet" "https://www.ti.com/cn/lit/gpn/hd3ss3212"+		(property "Datasheet" "https://www.ti.com/lit/ds/symlink/hd3ss3212.pdf" 			(at 0 0 0) 			(show_name no) 			(do_not_autoplace no)@@ -46,7 +67,7 @@ 				(font (size 1.27 1.27)) 			) 		)-		(property "Description" "2-channel 10-Gbps 2:1/1:2 USB 3.1 differential mux/demux"+		(property "Description" "0.6pF 0℃~+70℃ 2 2.7V~3.6V 2:1 500ns 500ns 5Ω 80ps 8GHz TQFN-20-EP(2.5x4.5) Analog Switches, Multiplexers ROHS" 			(at 0 0 0) 			(show_name no) 			(do_not_autoplace no)
hd3ss3212rksr.lbr+4−4
@@ -50,7 +50,7 @@ <layer number="98" name="Guide" color="6" fill="1" visible="yes" active="yes"/> </layers> <library>-<description>2-channel 10-Gbps 2:1/1:2 USB 3.1 differential mux/demux</description>+<description>0.6pF 0℃~+70℃ 2 2.7V~3.6V 2:1 500ns 500ns 5Ω 80ps 8GHz TQFN-20-EP(2.5x4.5) Analog Switches, Multiplexers ROHS</description> <packages> <package name="HD3SS3212RKSR">   <description>21 pads, 3.2 x 5.2 mm</description>@@ -94,7 +94,7 @@ </packages> <symbols> <symbol name="HD3SS3212RKSR">-  <description>2-channel 10-Gbps 2:1/1:2 USB 3.1 differential mux/demux</description>+  <description>0.6pF 0℃~+70℃ 2 2.7V~3.6V 2:1 500ns 500ns 5Ω 80ps 8GHz TQFN-20-EP(2.5x4.5) Analog Switches, Multiplexers ROHS</description>   <wire x1="-10.16" y1="20.32" x2="10.16" y2="20.32" width="0.254" layer="94"/>   <wire x1="10.16" y1="20.32" x2="10.16" y2="-20.32" width="0.254" layer="94"/>   <wire x1="10.16" y1="-20.32" x2="-10.16" y2="-20.32" width="0.254" layer="94"/>@@ -126,7 +126,7 @@ </symbols> <devicesets> <deviceset name="HD3SS3212RKSR" prefix="U">-  <description>2-channel 10-Gbps 2:1/1:2 USB 3.1 differential mux/demux</description>+  <description>0.6pF 0℃~+70℃ 2 2.7V~3.6V 2:1 500ns 500ns 5Ω 80ps 8GHz TQFN-20-EP(2.5x4.5) Analog Switches, Multiplexers ROHS</description>   <gates>     <gate name="G$1" symbol="HD3SS3212RKSR" x="0" y="0"/>   </gates>@@ -159,7 +159,7 @@         <technology name="">           <attribute name="MPN" value="HD3SS3212RKSR" constant="no"/>           <attribute name="MANUFACTURER" value="Texas Instruments" constant="no"/>-          <attribute name="DATASHEET" value="https://www.ti.com/cn/lit/gpn/hd3ss3212" constant="no"/>+          <attribute name="DATASHEET" value="https://www.ti.com/lit/ds/symlink/hd3ss3212.pdf" constant="no"/>           <attribute name="ADOM_WIKI" value="https://wiki.adom.inc/adom/hd3ss3212rksr" constant="no"/>           <attribute name="MOUSER_PN" value="595-HD3SS3212RKSR" constant="no"/>           <attribute name="DIGIKEY_PN" value="296-42174-2-ND" constant="no"/>
verification.json+4−50
@@ -34,7 +34,7 @@      "result": "pass"     },     {-     "text": "18 of 21 pins described from the datasheet (adom-ds2sf, page-cited)",+     "text": "20 of 21 pins described from the datasheet (adom-ds2sf, page-cited)",      "result": "note"     },     {@@ -49,7 +49,7 @@     }    ],    "files": {-    "hd3ss3212rksr.kicad_sym": "50546f4632bb363ab76cf31b3419dec89d8387e53519e8735d922ecc11830727",+    "hd3ss3212rksr.kicad_sym": "68257a7a7571555ad18c8fe62ce43a8bf37790ea1c589ef88420e771d95a4dd5",     "hd3ss3212rksr.kicad_mod": "946b1a376c8f77b917585cba3be9283611883dc885d79ddf3aa4977007894d72",     "hd3ss3212rksr.step": "06e9b308ad8d3fed4f7a36fa36fb661dfd9feed1ccfac283eeabad9ece45095f"    }@@ -84,7 +84,7 @@     "handle": "claude"    },    "status": "open",-   "title": "3 of 21 pins have no datasheet description yet (pins 1, 10, 21).",+   "title": "1 of 21 pins have no datasheet description yet (pins 21).",    "scope": [     "review"    ],@@ -93,53 +93,7 @@    ],    "checks": [     {-     "text": "3 of 21 pins have no datasheet description yet (pins 1, 10, 21).",-     "result": "note"-    }-   ],-   "evidence": [],-   "files": {}-  },-  {-   "date": "2026-10-08",-   "by": {-    "name": "Claude (AI build)",-    "handle": "claude"-   },-   "status": "open",-   "title": "Pin names differ between the board symbol and the datasheet (often equivalent naming; chec...",-   "scope": [-    "review"-   ],-   "variants": [-    "*"-   ],-   "checks": [-    {-     "text": "Pin names differ between the board symbol and the datasheet (often equivalent naming; check): 1: symbol \"RSVD1\" vs datasheet \"NC\"; 10: symbol \"RSVD2\" vs datasheet \"NC\"",-     "result": "note"-    }-   ],-   "evidence": [],-   "files": {}-  },-  {-   "date": "2026-10-08",-   "by": {-    "name": "Claude (AI build)",-    "handle": "claude"-   },-   "status": "open",-   "title": "Datasheet pins not matched to a symbol pin: NC",-   "scope": [-    "review"-   ],-   "variants": [-    "*"-   ],-   "checks": [-    {-     "text": "Datasheet pins not matched to a symbol pin: NC",+     "text": "1 of 21 pins have no datasheet description yet (pins 21).",      "result": "note"     }    ],