← Commit history

gd32e230f8p6tr: backfill missing artifacts (variants)

Ray ·d84ddeda88 · ·parent 80d8287
2 files changed +77−1
README.md+2
@@ -40,6 +40,8 @@ GD32E230F8P6TR from GigaDevice Semicon Beijing, in a TSSOP-20. Pinout and pin de  ## Ordering variants +Same part, different packaging or reel option.+ - `GD32E230F8P6TR` - `GD32E230F8P6TRF6P6` - `GD32E230F8P6TRF4P6`
page.json+75−1
@@ -227,5 +227,79 @@   ],   "visibility": {     "public": true-  }+  },+  "variants": [+    {+      "mpn": "GD32E230F8P6TR",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRF6P6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRF4P6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRF8V6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRF6V6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRF4V6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRG8U6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRG6U6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRG4U6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRK8U6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRK6U6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRK4U6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRK8T6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRK6T6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRK4T6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRC8T6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRC6T6",+      "kind": "packaging"+    },+    {+      "mpn": "GD32E230F8P6TRC4T6",+      "kind": "packaging"+    }+  ] }\ No newline at end of file