component
FM4057E42
Public Made by Adomby adom
Shenzhen Fuman Battery Management, ESOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
page.json+8−5@@ -38,7 +38,7 @@ "number": "2", "name": "ISET", "type": "input",- "description": "Charge-current programming input. An external resistor from ISET to GND sets the constant-current charge level (typ. 1.0A at 3k\u03a9, 0.6A at 5k\u03a9, 0.5A at 6k\u03a9). Also sets precharge (~60mA at 5k\u03a9) and termination (~60mA at 5k\u03a9) thresholds."+ "description": "Charge-current programming input. An external resistor from ISET to GND sets the constant-current charge level (typ. 1.0A at 3kΩ, 0.6A at 5kΩ, 0.5A at 6kΩ). Also sets precharge (~60mA at 5kΩ) and termination (~60mA at 5kΩ) thresholds." }, { "number": "3",@@ -50,13 +50,13 @@ "number": "4", "name": "VIN", "type": "power_in",- "description": "Charger input supply. Recommended operating range 4.2V-6.5V (typ. 5V); withstands up to 32V. Internal VIN OVP trips at 6.5V (0.5V hysteresis) and UVLO at 4.6V rising / 4.2V falling. Bypass with \u22654.7\u00b5F (a 1\u00b5F may be used per app circuit)."+ "description": "Charger input supply. Recommended operating range 4.2V-6.5V (typ. 5V); withstands up to 32V. Internal VIN OVP trips at 6.5V (0.5V hysteresis) and UVLO at 4.6V rising / 4.2V falling. Bypass with ≥4.7µF (a 1µF may be used per app circuit)." }, { "number": "5", "name": "BAT", "type": "power_out",- "description": "Battery connection to the single-cell Li-ion pack. E42 regulates to 4.2V (V_BAT_FULL = 4.158/4.2/4.242V). Recharge threshold ~4.05V, battery OVP at 104%\u00b7V_BAT. Requires ~10\u00b5F bypass capacitor to GND."+ "description": "Battery connection to the single-cell Li-ion pack. E42 regulates to 4.2V (V_BAT_FULL = 4.158/4.2/4.242V). Recharge threshold ~4.05V, battery OVP at 104%·V_BAT. Requires ~10µF bypass capacitor to GND." }, { "number": "6",@@ -80,7 +80,7 @@ "number": "9", "name": "EPAD", "type": "power_in",- "description": "Exposed thermal pad on package underside. Must be soldered to the PCB ground plane for the specified thermal performance; electrically connected to GND (\u6563\u70ed\u5730)."+ "description": "Exposed thermal pad on package underside. Must be soldered to the PCB ground plane for the specified thermal performance; electrically connected to GND (散热地)." } ], "provenance": {@@ -144,5 +144,8 @@ "docs/fm4057e42-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }