component
EUP3484DIR1
Public Made by Adomby adom
Eutech Microelectronics DC-DC Converters, SOIC-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+8−5@@ -32,7 +32,7 @@ "number": "1", "name": "BS", "type": "passive",- "description": "High-Side Gate Drive Boost Input. Supplies drive for the high-side N-Channel DMOS switch. Connect a 0.01\u03bcF (10nF) or greater bootstrap capacitor from SW to BS to power the high-side switch. Absolute maximum: VSW-0.3V to VSW+6V."+ "description": "High-Side Gate Drive Boost Input. Supplies drive for the high-side N-Channel DMOS switch. Connect a 0.01μF (10nF) or greater bootstrap capacitor from SW to BS to power the high-side switch. Absolute maximum: VSW-0.3V to VSW+6V." }, { "number": "2",@@ -56,7 +56,7 @@ "number": "5", "name": "FB", "type": "input",- "description": "Output Feedback Input. Senses and regulates the output voltage. Drive FB with a resistive voltage divider from the output; feedback threshold is 0.925V (typ). VOUT = 0.925 \u00d7 (R1+R2)/R2."+ "description": "Output Feedback Input. Senses and regulates the output voltage. Drive FB with a resistive voltage divider from the output; feedback threshold is 0.925V (typ). VOUT = 0.925 × (R1+R2)/R2." }, { "number": "6",@@ -74,13 +74,13 @@ "number": "8", "name": "SS", "type": "passive",- "description": "Soft-Start Control Input. Connect an external capacitor (e.g. 0.1\u03bcF) to program the soft-start ramp; charge current is typ 6\u03bcA. Leave open to use the internal soft-start function."+ "description": "Soft-Start Control Input. Connect an external capacitor (e.g. 0.1μF) to program the soft-start ramp; charge current is typ 6μA. Leave open to use the internal soft-start function." }, { "number": "9", "name": "GND (Exposed Pad)", "type": "power_in",- "description": "Exposed thermal pad on package underside. Electrically tied to GND (pin 4). Must be soldered to the PCB ground plane with multiple thermal vias for proper thermal and electrical performance (\u03b8JA \u2248 60\u00b0C/W)."+ "description": "Exposed thermal pad on package underside. Electrically tied to GND (pin 4). Must be soldered to the PCB ground plane with multiple thermal vias for proper thermal and electrical performance (θJA ≈ 60°C/W)." } ], "provenance": {@@ -144,5 +144,8 @@ "docs/eup3484dir1-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }