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Initial commit: component/cdcm61002rhbr

Ray ·4d40375709 ·
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README.mdadded+73
@@ -0,0 +1,73 @@+# CDCM61002RHBR++**Texas Instruments** · Clock Generators / Frequency Synthesizers / PLL · VQFN-32-EP(5x5)++CDCM61002RHBR from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VCC_OUT | power_in | 3.3-V supply for the output buffers (3.0-3.6 V). Bypass to GND close to the pin. |+| 2 | OUTN1 | output | Universal output channel 1, negative leg. Forms a differential pair with OUTP1 (LVPECL/LVDS) or acts as an independent LVCMOS output depending on OS[1:0]. |+| 3 | OUTP1 | output | Universal output channel 1, positive leg. Forms a differential pair with OUTN1 (LVPECL/LVDS) or acts as an independent LVCMOS output depending on OS[1:0]. |+| 4 | VCC_OUT | power_in | 3.3-V supply for the output buffers (3.0-3.6 V). Second VCC_OUT pin; bypass to GND close to the pin. |+| 5 | OUTN0 | output | Universal output channel 0, negative leg. Forms a differential pair with OUTP0 (LVPECL/LVDS) or acts as an independent LVCMOS output depending on OS[1:0]. |+| 6 | OUTP0 | output | Universal output channel 0, positive leg. Forms a differential pair with OUTN0 (LVPECL/LVDS) or acts as an independent LVCMOS output depending on OS[1:0]. |+| 7 | CE | input | Chip Enable control pin (3.3-V LVCMOS). CE=1 places the device in normal operation; CE=0 powers the outputs down (Hi-Z). Internal 150 kΩ pull-up. |+| 8 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 9 | VCC_VCO | power_in | 3.3-V supply for the internal LC-based VCO (3.0-3.6 V). Requires clean bypassing for low phase noise. |+| 10 | OS1 | input | Output type select bit 1 (3.3-V LVCMOS). Together with OS0 selects LVCMOS, LVDS, or LVPECL on the universal outputs and enables/disables OSC_OUT (see Table 6). Internal 150 kΩ pull-up. |+| 11 | OS0 | input | Output type select bit 0 (3.3-V LVCMOS). Together with OS1 selects LVCMOS, LVDS, or LVPECL on the universal outputs and enables/disables OSC_OUT (see Table 6). Internal 150 kΩ pull-up. |+| 12 | RSTN | input | Active-low device reset / PLL recalibration trigger (3.3-V LVCMOS). Must be pulsed low then high after any change to PLL settings. Internal 150 kΩ pull-up. |+| 13 | OD0 | input | Output divider select bit 0 (3.3-V LVCMOS). OD[2:0] selects the shared output divider ratio 1/2/3/4/6/8 (see Table 5). Internal 150 kΩ pull-up. |+| 14 | OD1 | input | Output divider select bit 1 (3.3-V LVCMOS). OD[2:0] selects the shared output divider ratio 1/2/3/4/6/8 (see Table 5). Internal 150 kΩ pull-up. |+| 15 | OD2 | input | Output divider select bit 2 (3.3-V LVCMOS). OD[2:0] selects the shared output divider ratio 1/2/3/4/6/8 (see Table 5). Internal 150 kΩ pull-up. |+| 16 | VCC_PLL2 | power_in | 3.3-V supply for the PLL circuitry (3.0-3.6 V). Requires clean bypassing for low phase noise. |+| 17 | REG_CAP2 | passive | Internal regulator bypass node. Connect a 10-μF Y5V capacitor from this pin to GND; do not drive externally. |+| 18 | VCC_PLL1 | power_in | 3.3-V supply for the PLL circuitry (3.0-3.6 V). Requires clean bypassing for low phase noise. |+| 19 | REG_CAP1 | passive | Internal regulator bypass node. Connect a 10-μF Y5V capacitor from this pin to GND; do not drive externally. |+| 20 | VCC_IN | power_in | 3.3-V supply for the input buffers (3.0-3.6 V). Bypass to GND close to the pin. |+| 21 | XIN | input | Parallel-resonant crystal input, also usable as an LVCMOS reference input. Accepts a 21.875-28.47 MHz fundamental-mode crystal (ESR ≤50 Ω, on-chip load ~8-10 pF) or a single-ended LVCMOS clock. |+| 22 | GND1 | power_in | Additional device ground; internally shorted on-chip to the thermal pad GND. Must be tied to the board ground plane. |+| 23 | OSC_OUT | output | Buffered LVCMOS bypass output of the crystal/input reference (21.875-28.47 MHz). Enabled only when OS[1:0] = 11 per Table 6; otherwise held off. |+| 24 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 25 | PR0 | input | Prescaler/feedback divider select bit 0 (3.3-V LVCMOS). PR[1:0] selects one of four prescaler/feedback pairs (3/24, 5/15, 3/25, 4/20) per Table 4. Internal 150 kΩ pull-up. |+| 26 | PR1 | input | Prescaler/feedback divider select bit 1 (3.3-V LVCMOS). PR[1:0] selects one of four prescaler/feedback pairs (3/24, 5/15, 3/25, 4/20) per Table 4. Internal 150 kΩ pull-up. |+| 27 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 28 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 29 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 30 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 31 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 32 | NC | unconnected | No connect. Leave floating or tie to GND. |+| 33 | GND | power_in | Exposed thermal pad. Must be soldered to the board ground plane; serves as both the primary electrical ground and the primary thermal path (θJP ≈ 4 °C/W with 9 thermal vias). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | VQFN-32-EP(5x5) |+| Category | RTC |+| Pins | 33 |++## Ordering variants++- `CDCM61002RHBR`+- `CDCM61002RHBRRHBT`++## CAD (KiCad official)++- Symbol: `CDCM61002RHBR`+- Footprint: `Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm`+- 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/cdcm61002rhbr.pdf) (None pp, sha256 `dbdb729c3479948f`, retrieved 2026-08-17, tier: manufacturer)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/cdcm61002rhbr-datasheet.pdf)
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