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cc2500rgpr: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)

Ray ·d884feb9d0 · ·parent 5eac355
2 files changed +88−8
package.json+46−6
@@ -119,13 +119,13 @@         "number": "12",         "name": "RF_P",         "type": "bidirectional",-        "description": "Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 \u03a9."+        "description": "Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 Ω."       },       {         "number": "13",         "name": "RF_N",         "type": "bidirectional",-        "description": "Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 \u03a9."+        "description": "Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 Ω."       },       {         "number": "14",@@ -149,7 +149,7 @@         "number": "17",         "name": "RBIAS",         "type": "bidirectional",-        "description": "External bias resistor connection (typically 56 k\u03a9 to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits."+        "description": "External bias resistor connection (typically 56 kΩ to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits."       },       {         "number": "18",@@ -173,7 +173,7 @@         "number": "21",         "name": "Exposed Die Attach Pad (EP)",         "type": "power_in",-        "description": "Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5\u00d70.01 in diameter) for thermal dissipation and low impedance return path."+        "description": "Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5×0.01 in diameter) for thermal dissipation and low impedance return path."       }     ],     "provenance": {@@ -210,6 +210,46 @@     "viewers": {       "symbol": "viewers/symbol.html",       "footprint": "viewers/footprint.html"-    }+    },+    "models_3d": [+      {+        "file": "cc2500rgpr.step",+        "role": "plain",+        "up": "Z",+        "units": "mm",+        "origin": "footprint origin = pad-pattern centre",+        "seat": "z = 0",+        "extents_mm": [+          4.0,+          4.0,+          0.77+        ],+        "zmin_mm": 0.0,+        "centre_offset_mm": 0.0,+        "footprint_binding": "identity",+        "sha256": "c9476a1612023de37f27b4972110ab6ac6dc0eaf5ac48957a2e1c497650082a5",+        "checked": "2026-10-07",+        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"+      },+      {+        "file": "cc2500rgpr-etched.step",+        "role": "eda",+        "up": "Z",+        "units": "mm",+        "origin": "footprint origin = pad-pattern centre",+        "seat": "z = 0",+        "extents_mm": [+          4.0,+          4.0,+          0.77+        ],+        "zmin_mm": 0.0,+        "centre_offset_mm": 0.0,+        "footprint_binding": "identity",+        "sha256": "5670e7aea22885ff57c3a0f79c84b3ddd1a040c79229f0c31737681bb7da80e5",+        "checked": "2026-10-07",+        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"+      }+    ]   }-}\ No newline at end of file+}
page.json+42−2
@@ -195,7 +195,47 @@     "viewers": {       "symbol": "viewers/symbol.html",       "footprint": "viewers/footprint.html"-    }+    },+    "models_3d": [+      {+        "file": "cc2500rgpr.step",+        "role": "plain",+        "up": "Z",+        "units": "mm",+        "origin": "footprint origin = pad-pattern centre",+        "seat": "z = 0",+        "extents_mm": [+          4.0,+          4.0,+          0.77+        ],+        "zmin_mm": 0.0,+        "centre_offset_mm": 0.0,+        "footprint_binding": "identity",+        "sha256": "c9476a1612023de37f27b4972110ab6ac6dc0eaf5ac48957a2e1c497650082a5",+        "checked": "2026-10-07",+        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"+      },+      {+        "file": "cc2500rgpr-etched.step",+        "role": "eda",+        "up": "Z",+        "units": "mm",+        "origin": "footprint origin = pad-pattern centre",+        "seat": "z = 0",+        "extents_mm": [+          4.0,+          4.0,+          0.77+        ],+        "zmin_mm": 0.0,+        "centre_offset_mm": 0.0,+        "footprint_binding": "identity",+        "sha256": "5670e7aea22885ff57c3a0f79c84b3ddd1a040c79229f0c31737681bb7da80e5",+        "checked": "2026-10-07",+        "checked_by": "factory/step_pose.py (Z-up, origin, seat, binding)"+      }+    ]   },   "metadata": {     "specs": {@@ -243,4 +283,4 @@     "public": true   },   "updated_at": "2026-09-24T18:31:17.018Z"-}\ No newline at end of file+}