← Commit history

Set visibility: public

Ray ·34f39559db · ·parent 3a35f49
1 file changed +8−5
page.json+8−5
@@ -104,13 +104,13 @@         "number": "12",         "name": "RF_P",         "type": "bidirectional",-        "description": "Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 \u03a9."+        "description": "Positive differential RF signal to LNA in receive mode, positive RF output from PA in transmit mode; differential load impedance 80 + j74 Ω."       },       {         "number": "13",         "name": "RF_N",         "type": "bidirectional",-        "description": "Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 \u03a9."+        "description": "Negative differential RF signal to LNA in receive mode, negative RF output from PA in transmit mode; differential load impedance 80 + j74 Ω."       },       {         "number": "14",@@ -134,7 +134,7 @@         "number": "17",         "name": "RBIAS",         "type": "bidirectional",-        "description": "External bias resistor connection (typically 56 k\u03a9 to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits."+        "description": "External bias resistor connection (typically 56 kΩ to ground); sets internal reference current for LNA, mixer, and other analog front-end circuits."       },       {         "number": "18",@@ -158,7 +158,7 @@         "number": "21",         "name": "Exposed Die Attach Pad (EP)",         "type": "power_in",-        "description": "Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5\u00d70.01 in diameter) for thermal dissipation and low impedance return path."+        "description": "Thermal ground pad and primary ground connection for the chip; must be soldered to solid ground plane using multiple vias (minimum 5×0.01 in diameter) for thermal dissipation and low impedance return path."       }     ],     "provenance": {@@ -238,5 +238,8 @@     "docs/cc2500rgpr-datasheet.pdf",     "viewers/symbol.html",     "viewers/footprint.html"-  ]+  ],+  "visibility": {+    "public": true+  } }\ No newline at end of file