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Initial commit: component/bq40z50rsmr-r1

Ray ·6d0512c7b8 ·2mo ago
2 files changed +109
README.mdadded+75
@@ -0,0 +1,75 @@+# BQ40Z50RSMR-R1++**Texas Instruments** · Battery Management · VQFN-32-EP(4x4)++BQ40Z50RSMR-R1 from Texas Instruments, in a VQFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | PBI | power_in | Power supply backup input pin. Backup rail that maintains RAM/RTC context when primary supplies are lost. |+| 2 | VC4 | input | Sense voltage input for the most positive cell (Cell 4) and balance current input for that cell. |+| 3 | VC3 | input | Sense voltage input for second-most-positive cell (Cell 3), balance current input, and return path for Cell 4 balance current. |+| 4 | VC2 | input | Sense voltage input for third-most-positive cell (Cell 2), balance current input, and return path for Cell 3 balance current. |+| 5 | VC1 | input | Sense voltage input for the least positive cell (Cell 1), balance current input, and return path for Cell 2 balance current. |+| 6 | SRN | input | Coulomb-counter negative sense input. Integrates the small voltage across the sense resistor between SRP and SRN. |+| 7 | NC | unconnected | Not internally connected. Connect to VSS per the datasheet. |+| 8 | SRP | input | Coulomb-counter positive sense input; top of the sense resistor. Integrates the small voltage between SRP and SRN. |+| 9 | VSS | power_in | Device ground reference. |+| 10 | TS1 | input | Temperature sensor 1 thermistor input (NTC). Ratiometric input via internal 18 kΩ pull-up to 1.8 V. |+| 11 | TS2 | input | Temperature sensor 2 thermistor input. |+| 12 | TS3 | input | Temperature sensor 3 thermistor input. |+| 13 | TS4 | input | Temperature sensor 4 thermistor input. |+| 14 | NC | unconnected | Not internally connected. |+| 15 | BTP_INT | output | Battery Trip Point interrupt output. Signals the host when configured state-of-charge thresholds are crossed. |+| 16 | PRES/SHUTDN | input | Host-present input for removable packs, or emergency system-shutdown input for embedded packs. Function is firmware-configurable. |+| 17 | DISP | input | Display control input for the LED state-of-charge indicator. Asserting this pin activates the LEDCNTLA/B/C outputs. |+| 18 | SMBD | bidirectional | SMBus data line (open-drain). Compatible with SMBus v1.1; requires external pull-up. |+| 19 | SMBC | bidirectional | SMBus clock line (open-drain). Compatible with SMBus v1.1; requires external pull-up. |+| 20 | LEDCNTLA | output | LED display segment A output; drives external LEDs per firmware configuration (fuel gauge display). |+| 21 | LEDCNTLB | output | LED display segment B output; drives external LEDs per firmware configuration. |+| 22 | LEDCNTLC | output | LED display segment C output; drives external LEDs per firmware configuration. |+| 23 | PTC | input | Safety PTC thermistor input. Tie both PTC and PTCEN to VSS to disable the PTC safety detector. |+| 24 | PTCEN | input | PTC enable input. Connect to BAT to enable PTC detection; tie both PTC and PTCEN to VSS to disable. |+| 25 | FUSE | output | Fuse drive output. Drives an external chemical fuse to permanently disable the pack under 2nd-level safety events. |+| 26 | VCC | power_in | Secondary power supply input (typically PACK-side sourced through a diode) for the internal LDO/regulators. |+| 27 | PACK | input | Pack-side voltage sense input. Monitors PACK+ node for insertion/removal and pre-charge control. |+| 28 | DSG | output | High-side N-channel discharge FET gate drive output. Charge-pumped above BAT to fully enhance the external DSG FET. |+| 29 | NC | unconnected | Not internally connected. |+| 30 | PCHG | output | P-channel pre-charge FET gate drive output. |+| 31 | CHG | output | High-side N-channel charge FET gate drive output. Charge-pumped above BAT to fully enhance the external CHG FET. |+| 32 | BAT | power_in | Primary power supply input pin, connected to the top of the cell stack. |+| 33 | EP | passive | Exposed thermal pad on the underside of the VQFN package. Solder to the PCB ground plane for thermal and mechanical performance. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | VQFN-32-EP(4x4) |+| Category | PMIC |+| Pins | 33 |++## Ordering variants++Same part, different packaging or reel option.++- `BQ40Z50RSMR-R1`+- `BQ40Z50RSMR-R1RSMT`++## CAD (KiCad official)++- Symbol: `BQ40Z50RSMR-R1`+- Footprint: `Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm`+- 3D model: VQFN-32-EP(4x4) (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/bq40z50rsmr-r1.pdf) (55 pp, sha256 `8fb42a3177aabd62`, retrieved 2026-08-17, tier: manufacturer)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/bq40z50rsmr-r1-datasheet.pdf)
page.jsonadded+34
@@ -0,0 +1,34 @@+{+  "slug": "bq40z50rsmr-r1",+  "version": "0.1.0",+  "type": "component",+  "description": "Texas Instruments Battery Management, VQFN-32-EP(4x4). Datasheet-verified pinout, KiCad symbol/footprint/3D.",+  "tags": [+    "component",+    "pmic",+    "bq40z50rsmr-r1"+  ],+  "dependencies": {},+  "hero": {+    "type": "image",+    "path": "docs/hero.png"+  },+  "files": [+    "page.json",+    "README.md",+    "bq40z50rsmr-r1.kicad_sym",+    "bq40z50rsmr-r1.kicad_mod",+    "bq40z50rsmr-r1.glb",+    "bq40z50rsmr-r1.step",+    "bq40z50rsmr-r1.lbr",+    "docs/hero.png",+    "docs/bq40z50rsmr-r1-datasheet.pdf",+    "viewers/symbol.html",+    "viewers/footprint.html"+  ],+  "visibility": "public",+  "author": {+    "name": "Ray",+    "email": "[email protected]"+  }+}\ No newline at end of file