component
BQ294700DSGR
Public Made by Adomby adom
Texas Instruments Battery Management, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+46@@ -0,0 +1,46 @@+# BQ294700DSGR++**Texas Instruments** · Battery Management · WSON-8-EP(2x2)++BQ294700DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | VDD | power_in | Power supply input, operating range 3V to 20V per recommended operating conditions. |+| 2 | V4 | input | Analog input for detection of fourth cell positive voltage (top cell in 4S configuration), 0V to 5V range relative to VSS. |+| 3 | V3 | input | Analog input for detection of third cell positive voltage, 0V to 5V range relative to VSS. |+| 4 | V2 | input | Analog input for detection of second cell positive voltage, 0V to 5V range relative to VSS. |+| 5 | V1 | input | Analog input for detection of first cell positive voltage (bottom cell), 0V to 5V range relative to VSS. |+| 6 | VSS | power_in | Ground reference connected to IC ground and negative terminal of lowest cell in battery pack; voltage reference for all cell comparisons. |+| 7 | CD | output | External delay timer capacitor connection (0.1µF to 1.0µF nominal), charged and discharged by IC to set overvoltage protection delay of 1s to 2s. |+| 8 | OUT | output | Overvoltage fault signal output, active-high CMOS logic (6V high, 250-400mV low) for BQ294700 variant with 4.5mA source and 14mA sink current capability. |+| 9 | PWPD | power_in | Exposed thermal pad for improved thermal dissipation; must be soldered to VSS or ground plane on PCB for thermal performance. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | WSON-8-EP(2x2) |+| Category | Power Management (PMIC) |+| Pins | 9 |++## CAD (KiCad official)++- Symbol: `BQ294700DSGR`+- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`+- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)+- 3D model files: `bq294700dsgr-etched.step` / `bq294700dsgr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bq294700dsgr.step` / `bq294700dsgr.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/bq2947) (30 pp, sha256 `0bb66de94396f561`, retrieved 2026-09-23, tier: lcsc)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/bq294700dsgr-datasheet.pdf)
page.jsonadded+150@@ -0,0 +1,150 @@+{+ "slug": "bq294700dsgr",+ "version": "0.1.0",+ "type": "component",+ "description": "Texas Instruments Battery Management, WSON-8-EP(2x2). Datasheet-verified pinout, KiCad symbol/footprint/3D.",+ "tags": [+ "component",+ "power management (pmic)",+ "bq294700dsgr",+ "factory-2.0.0",+ "extractor-text"+ ],+ "dependencies": {},+ "hero": {+ "type": "image",+ "path": "docs/hero.png"+ },+ "files": [+ "page.json",+ "README.md",+ "bq294700dsgr.kicad_sym",+ "bq294700dsgr.kicad_mod",+ "bq294700dsgr.glb",+ "bq294700dsgr.step",+ "bq294700dsgr.lbr",+ "docs/hero.png",+ "docs/bq294700dsgr-datasheet.pdf",+ "viewers/symbol.html",+ "viewers/footprint.html"+ ],+ "component": {+ "mpn": "BQ294700DSGR",+ "manufacturer": "Texas Instruments",+ "package": "WSON-8-EP(2x2)",+ "pin_count": 9,+ "category": "Power Management (PMIC)",+ "subcategory": "Battery Management",+ "datasheet": "https://www.ti.com/cn/lit/gpn/bq2947",+ "parts": {+ "symbol": "bq294700dsgr.kicad_sym",+ "footprint": "bq294700dsgr.kicad_mod",+ "model_3d": "bq294700dsgr-etched.glb",+ "model_3d_plain": "bq294700dsgr.glb",+ "model_3d_step": "bq294700dsgr-etched.step",+ "model_3d_step_plain": "bq294700dsgr.step",+ "lbr": "bq294700dsgr.lbr"+ },+ "distributor_links": {+ "lcsc": "C414622"+ },+ "pins": [+ {+ "number": "1",+ "name": "VDD",+ "type": "power_in",+ "description": "Power supply input, operating range 3V to 20V per recommended operating conditions."+ },+ {+ "number": "2",+ "name": "V4",+ "type": "input",+ "description": "Analog input for detection of fourth cell positive voltage (top cell in 4S configuration), 0V to 5V range relative to VSS."+ },+ {+ "number": "3",+ "name": "V3",+ "type": "input",+ "description": "Analog input for detection of third cell positive voltage, 0V to 5V range relative to VSS."+ },+ {+ "number": "4",+ "name": "V2",+ "type": "input",+ "description": "Analog input for detection of second cell positive voltage, 0V to 5V range relative to VSS."+ },+ {+ "number": "5",+ "name": "V1",+ "type": "input",+ "description": "Analog input for detection of first cell positive voltage (bottom cell), 0V to 5V range relative to VSS."+ },+ {+ "number": "6",+ "name": "VSS",+ "type": "power_in",+ "description": "Ground reference connected to IC ground and negative terminal of lowest cell in battery pack; voltage reference for all cell comparisons."+ },+ {+ "number": "7",+ "name": "CD",+ "type": "output",+ "description": "External delay timer capacitor connection (0.1µF to 1.0µF nominal), charged and discharged by IC to set overvoltage protection delay of 1s to 2s."+ },+ {+ "number": "8",+ "name": "OUT",+ "type": "output",+ "description": "Overvoltage fault signal output, active-high CMOS logic (6V high, 250-400mV low) for BQ294700 variant with 4.5mA source and 14mA sink current capability."+ },+ {+ "number": "9",+ "name": "PWPD",+ "type": "power_in",+ "description": "Exposed thermal pad for improved thermal dissipation; must be soldered to VSS or ground plane on PCB for thermal performance."+ }+ ],+ "provenance": {+ "extractor": "extract_pins 0.2",+ "factory_chain": {+ "factory": "2.0.0",+ "extractor": "extract_pins 0.2",+ "primary_model": "claude-haiku-4-5-20251001",+ "primary_mode": "text",+ "consensus_model": "claude-sonnet-5",+ "consensus": "agreed",+ "guards": "pin_guards 0.1: passed",+ "guard_notes": [+ "extractor flagged: Thermal pad (PWPD) assigned pin number '9' based on sequential convention and board layout reference",+ "1/9 pins cited to the wrong page (name found elsewhere): ['9:PWPD@p4']"+ ],+ "pages_sent": 30,+ "cost_usd": 0.3255,+ "at": "2026-09-23T07:05:08"+ },+ "datasheet": {+ "url": "https://www.ti.com/cn/lit/gpn/bq2947",+ "pages": 30,+ "sha256": "0bb66de94396f561",+ "source_tier": "lcsc"+ },+ "cad": "KiCad official (CC-BY-SA 4.0)",+ "pins": {+ "total": 9,+ "described": 9,+ "cites_pages": true,+ "refuses_to_fabricate": true+ }+ },+ "viewers": {+ "symbol": "viewers/symbol.html",+ "footprint": "viewers/footprint.html"+ }+ },+ "visibility": "public",+ "org": "adom",+ "author": {+ "name": "Ray",+ "email": "[email protected]"+ }+}