← Commit history

add measured board stackup table (FR4/copper/mask z-heights + 4-layer set from design rules)

John Lauer ·e802f55449 ·3mo ago ·parent 205ee18
1 file changed +19
README.md+19
@@ -16,6 +16,25 @@ charger IC and power stage, passives, connectors, and the **Adom machine pins st around the board edges. Drag to orbit, scroll to zoom. Colors are the real Fusion materials, preserved through the STEP to GLB pipeline. ++## Board stackup (measured from the design)++Queried from the design itself: layer geometry measured from the exported 3D bodies, layer set and+thicknesses from the EAGLE design rules (`layerSetup (1+2*15+16)` = 4-layer, 35um copper per layer).++| Layer | Z (mm) | Thickness |+|---|---|---|+| Components (pick-and-place, reflow) | above 1.582 | varies |+| Top silkscreen | on top of mask | ink |+| Top soldermask | 1.516 to 1.582 | 65 um |+| Top copper (traces, layer 1) | 1.516 to 1.551 | 35 um |+| FR4 core + inner layers (2, 15) | 0.000 to 1.516 | 1.516 mm |+| Bottom copper (layer 16) | -0.035 to 0.000 | 35 um |+| Bottom soldermask | -0.065 to 0.000 | 65 um |++The 3D model reflects this: the copper bodies are REAL 3D geometry (35 um thick) recolored to+polished copper, visible through the translucent soldermask - not a texture overlay.+ ## What the BQ25792 does  | Feature | Detail |