BD9E302EFJ-E2

@@ -0,0 +1,50 @@+# BD9E302EFJ-E2++**ROHM** · DC-DC Converters · HTSOP-8-EP++BD9E302EFJ-E2 from ROHM, in a HTSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | BOOT | passive | Bootstrap capacitor terminal for high-side MOSFET gate drive. Connect a 0.1 uF ceramic capacitor between BOOT and SW; the capacitor voltage becomes the gate-drive rail for the high-side MOSFET. |+| 2 | VIN | power_in | Power supply input for the switching regulator and internal control circuits. Operating range 7.0 V to 28 V (absolute max +30 V). A 10 uF + 0.1 uF ceramic input capacitor is recommended. |+| 3 | EN | input | Enable input. Low level (<=0.8 V) forces shutdown mode; high level (>=2.5 V) enables the device. Must be driven (not left floating). Typical EN input current 4 uA at VEN=3 V. |+| 4 | AGND | power_in | Analog ground reference for the internal control circuitry. Should be tied to the system ground plane at a low-noise point separate from the switching (PGND) return. |+| 5 | FB | input | Feedback / inverting input to the gm error amplifier. Internal reference is 0.800 V (typ); an external resistor divider from VOUT sets the output voltage. Input current +/-1 uA max. |+| 6 | COMP | output | Error-amplifier output / current-comparator input. Connect an R-C phase-compensation network to AGND here to set the loop response. |+| 7 | PGND | power_in | Power ground return for the output stage (low-side MOSFET source). Carries the switching return current; route as a low-impedance plane to the input capacitor negative terminal. |+| 8 | SW | power_out | Switch node: source of the internal high-side MOSFET and drain of the low-side MOSFET. Connect the power inductor here and the 0.1 uF bootstrap capacitor to BOOT. Rated -0.5 V to VIN+0.3 V. |+| 9 | E-Pad | power_in | Exposed thermal pad on package underside. Solder to the PCB ground plane using multiple thermal vias for heat dissipation; electrically tied to internal ground. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | ROHM |+| Package | HTSOP-8-EP |+| Category | PMIC |+| Pins | 9 |++## Ordering variants++Same part, different packaging or reel option.++- `BD9E302EFJ-E2`++## CAD (KiCad official)++- Symbol: `BD9E302EFJ-E2`+- Footprint: `Package_SO:HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm`+- 3D model: HTSOP-8-EP (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [ROHM datasheet](docs/bd9e302efj-e2-datasheet.pdf) (43 pp, sha256 `d4f722bb50e05130`, retrieved 2026-08-17, tier: manufacturer)+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/bd9e302efj-e2-datasheet.pdf)

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