AZ1117CR-3.3TRG1 - Commit

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distributor part numbers (lcsc=C460428). page.json only: this page's .lbr could not be rebuilt because the symbol pin numbers do not resolve against the footprint pad names (connect-pad-unresolved), and publishing a library that fails validate would be worse than leaving the old one. Once the footprint is fixed a rebuild will carry these into <technology> automatically.

Ray ·a46ae8b96c ·2mo ago ·parent 03ba422

1 file changed +6−4

page.json+6−4

@@ -26,7 +26,9 @@       "model_3d_step": "az1117cr-3-3trg1.step",       "lbr": "az1117cr-3-3trg1.lbr"     },-    "distributor_links": {},+    "distributor_links": {+      "lcsc": "C460428"+    },     "pins": [       {         "number": "1",@@ -38,19 +40,19 @@         "number": "2",         "name": "OUTPUT",         "type": "power_out",-        "description": "Regulated 3.3V output (±1%). Requires a minimum 10µF output capacitor with ESR <20Ω (low-ESR ceramic recommended). Current limit typ. 1.35A, dropout typ. 1.2V at 0.8A."+        "description": "Regulated 3.3V output (\u00b11%). Requires a minimum 10\u00b5F output capacitor with ESR <20\u03a9 (low-ESR ceramic recommended). Current limit typ. 1.35A, dropout typ. 1.2V at 0.8A."       },       {         "number": "3",         "name": "INPUT",         "type": "power_in",-        "description": "Unregulated input supply, up to 15V recommended (18V absolute max). Bypass with a 10µF capacitor close to the pin."+        "description": "Unregulated input supply, up to 15V recommended (18V absolute max). Bypass with a 10\u00b5F capacitor close to the pin."       },       {         "number": "4",         "name": "VOUT",         "type": "power_out",-        "description": "SOT-89 metal tab, electrically connected to the OUTPUT pin. Serves as the primary heat-dissipation path - solder to a copper pour for improved thermal performance (θJA ≈ 170°C/W without heatsink, 150°C/W with heatsink)."+        "description": "SOT-89 metal tab, electrically connected to the OUTPUT pin. Serves as the primary heat-dissipation path - solder to a copper pour for improved thermal performance (\u03b8JA \u2248 170\u00b0C/W without heatsink, 150\u00b0C/W with heatsink)."       }     ],     "provenance": {