AT7456E

@@ -18,8 +18,46 @@   "derived_from": "TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm@sha256:deb6619eab16fab9"  },  "pad_count": 29,+ "symbol_pins": [+  "1",+  "10",+  "11",+  "12",+  "13",+  "14",+  "15",+  "16",+  "17",+  "18",+  "19",+  "2",+  "20",+  "21",+  "22",+  "23",+  "24",+  "25",+  "26",+  "27",+  "28",+  "3",+  "4",+  "5",+  "6",+  "7",+  "8",+  "9"+ ],  "paste_apertures": 6,- "issues": [],+ "issues": [+  {+   "kind": "pad-has-no-pin",+   "pad": "29",+   "thermal": true,+   "described_in_page": false,+   "detail": "footprint pad \"29\" is in copper but the SYMBOL has no pin for it - a thermal pad with no net will float"+  }+ ],  "pads": [   {    "pad": "1",@@ -876,15 +914,15 @@    ],    "layers": [],    "thermal": true,-   "pin": "EP",-   "name": "EP",-   "type": "power_in",-   "description": "Exposed thermal pad on the HTSSOP-28 package. Internally connected to AGND. Solder to the AGND copper plane for improved thermal dissipation. Do not use EP as an electrical ground routing node.",+   "pin": "29",+   "name": null,+   "type": null,+   "description": null,    "is_pin1": false,    "source": {     "geometry": "TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm.kicad_mod",     "meaning": null,-    "correspondence": "derived: sole unmatched pin \"EP\" to sole thermal pad \"29\""+    "correspondence": "kicad: symbol pin number == pad name"    }   }  ]