component
AT7456E
Public Made by Adomby adom
ZHONGKEWEI EEPROM, TSSOP-28-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
add symbol pin "29" for the exposed thermal pad: the footprint carries the pad and the symbol had none, so it reached no net (vendor string 'TSSOP-28-EP' denotes an exposed pad)
4 files changed
+15−21
at7456e.kicad_sym+4@@ -120,6 +120,10 @@ (name "N.C." (effects (font (size 1.27 1.27)))) (number "15" (effects (font (size 1.27 1.27)))) )+ (pin power_in line (at -17.78 -20.32 0) (length 5.08)+ (name "EP" (effects (font (size 1.27 1.27))))+ (number "29" (effects (font (size 1.27 1.27))))+ ) ) ) )
at7456e.lbr+2@@ -129,6 +129,7 @@ <pin name="VSYNC" x="17.78" y="-12.7" length="middle" direction="out" rot="R180"/> <pin name="N.C.@6" x="17.78" y="-15.24" length="middle" direction="io" rot="R180"/> <pin name="N.C.@7" x="17.78" y="-17.78" length="middle" direction="io" rot="R180"/>+ <pin name="EP" x="-17.78" y="-20.32" length="middle" direction="pwr"/> </symbol> </symbols> <devicesets>@@ -168,6 +169,7 @@ <connect gate="G$1" pin="VSYNC" pad="17"/> <connect gate="G$1" pin="N.C.@6" pad="16"/> <connect gate="G$1" pin="N.C.@7" pad="15"/>+ <connect gate="G$1" pin="EP" pad="29"/> </connects> <technologies><technology name=""/></technologies> </device>
pads.json+6−19@@ -40,6 +40,7 @@ "26", "27", "28",+ "29", "3", "4", "5",@@ -49,21 +50,7 @@ "9" ], "paste_apertures": 6,- "issues": [- {- "kind": "pin-not-in-symbol",- "pin": "EP",- "name": "EP",- "detail": "page.json describes pin \"EP\" (EP) from the datasheet, but the symbol has no such pin, so nothing can connect to it"- },- {- "kind": "pad-has-no-pin",- "pad": "29",- "thermal": true,- "described_in_page": false,- "detail": "footprint pad \"29\" is in copper but the SYMBOL has no pin for it - a thermal pad with no net will float"- }- ],+ "issues": [], "pads": [ { "pad": "1",@@ -921,13 +908,13 @@ "layers": [], "thermal": true, "pin": "29",- "name": null,- "type": null,- "description": null,+ "name": "EP",+ "type": "power_in",+ "description": "Exposed thermal pad on the HTSSOP-28 package. Internally connected to AGND. Solder to the AGND copper plane for improved thermal dissipation. Do not use EP as an electrical ground routing node.", "is_pin1": false, "source": { "geometry": "TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm.kicad_mod",- "meaning": null,+ "meaning": "page.json:component.pins", "correspondence": "kicad: symbol pin number == pad name" } }
page.json+3−2@@ -197,10 +197,11 @@ "description": "No connect. Internally floating; leave unconnected." }, {- "number": "EP",+ "number": "29", "name": "EP", "type": "power_in",- "description": "Exposed thermal pad on the HTSSOP-28 package. Internally connected to AGND. Solder to the AGND copper plane for improved thermal dissipation. Do not use EP as an electrical ground routing node."+ "description": "Exposed thermal pad on the HTSSOP-28 package. Internally connected to AGND. Solder to the AGND copper plane for improved thermal dissipation. Do not use EP as an electrical ground routing node.",+ "source": "renumbered-to-footprint-pad" } ], "provenance": {