AP5056HSPER

@@ -18,8 +18,26 @@   "derived_from": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm@sha256:a7971720bdda0353"  },  "pad_count": 9,+ "symbol_pins": [+  "1",+  "2",+  "3",+  "4",+  "5",+  "6",+  "7",+  "8"+ ],  "paste_apertures": 4,- "issues": [],+ "issues": [+  {+   "kind": "pad-has-no-pin",+   "pad": "9",+   "thermal": true,+   "described_in_page": false,+   "detail": "footprint pad \"9\" is in copper but the SYMBOL has no pin for it - a thermal pad with no net will float"+  }+ ],  "pads": [   {    "pad": "1",@@ -276,15 +294,15 @@    ],    "layers": [],    "thermal": true,-   "pin": "EP",-   "name": "EPAD",-   "type": "power_in",-   "description": "Exposed thermal pad on the ESOP-8 package underside. Solder to a copper ground plane for heat dissipation; electrically tie to GND.",+   "pin": "9",+   "name": null,+   "type": null,+   "description": null,    "is_pin1": false,    "source": {     "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm.kicad_mod",     "meaning": null,-    "correspondence": "derived: sole unmatched pin \"EP\" to sole thermal pad \"9\""+    "correspondence": "kicad: symbol pin number == pad name"    }   }  ]