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ap2204r-3-3trg1: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
ap2204r-3-3trg1: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
ap2204r-3-3trg1: laser-etched CAD + chip hero (factory 2.0.0 backfill)
ap2204r-3-3trg1: hero re-rendered with iso-front (part number upright)
ap2204r-3-3trg1: manufacturer 'Diodes Incorporated' (was 'Diodes Incorporated AP2204R 3 3TRG1': the MPN had been folded in)
ap2204r-3-3trg1: laser-etched CAD + chip hero (factory 2.0.0 backfill)
ap2204r-3-3trg1: backfill missing artifacts (mfr, variants)
ap2204r-3-3trg1: publish the laser-etched STEP alongside the bare one
ap2204r-3-3trg1: factory component page (tier=mfr)
Initial commit: component/ap2204r-3-3trg1