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ap2111h-3-3trg1: footprint pads join the pin-hover bus with the symbol (4 pads)
ap2111h-3-3trg1: hero from the plain model
ap2111h-3-3trg1: one-pass backfill (hero prebuilt (inputs unchanged))
ap2111h-3-3trg1: one-pass backfill (ratings: VIN absolute_maximum 6.5 V p.6, VIN recommended_operating 6 V p.6)
ap2111h-3-3trg1: input/output capacitor conditions from the datasheet
courtyard follows the body and pads (63.36 -> 55.31 mm2, 12 vertices)
ap2111h-3-3trg1: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plai…
ap2111h-3-3trg1: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
ap2111h-3-3trg1: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
ap2111h-3-3trg1: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
ap2111h-3-3trg1: laser-etched CAD + chip hero (factory 2.0.0 backfill)
ap2111h-3-3trg1: hero re-rendered with iso-front (part number upright)
ap2111h-3-3trg1: manufacturer 'Diodes Incorporated' (was 'Diodes Incorporated AP2111H 3 3TRG1': the MPN had been folded…
ap2111h-3-3trg1: laser-etched CAD + chip hero (factory 2.0.0 backfill)
ap2111h-3-3trg1: backfill missing artifacts (mfr, variants)
ap2111h-3-3trg1: publish the laser-etched STEP alongside the bare one
ap2111h-3-3trg1: factory component page (tier=lcsc)
Initial commit: component/ap2111h-3-3trg1