☰
ams1117t-3-3g: one-pass backfill (ratings: VIN absolute_maximum 15 V p.3, VIN recommended_operating 12 V p.3)
ams1117t-3-3g: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
ams1117t-3-3g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero
ams1117t-3-3g: laser-etched CAD + chip hero (factory 2.0.0 backfill)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
ams1117t-3-3g: hero re-rendered with iso-front (part number upright)
ams1117t-3-3g: laser-etched CAD + chip hero (factory 2.0.0 backfill)
ams1117t-3-3g: hero re-rendered with iso-front (part number upright)
ams1117t-3-3g: manufacturer 'HANSCHIP semiconductor' (was 'HANSCHIP semiconductor AMS1117T 3 3G': the MPN had been fold…
ams1117t-3-3g: laser-etched CAD + chip hero (factory 2.0.0 backfill)
ams1117t-3-3g: backfill missing artifacts (mfr, variants)
ams1117t-3-3g: publish the laser-etched STEP alongside the bare one
ams1117t-3-3g: factory component page (tier=lcsc)
Initial commit: component/ams1117t-3-3g