component
AGM13T30D
Public Made by Adomby adom
AGM Semi MOSFETs, TO-252. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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page.json+7−4@@ -32,13 +32,13 @@ "number": "1", "name": "G", "type": "input",- "description": "Gate. Insulated MOSFET gate; VGS(th) typ 2.8 V (2-4 V range), absolute maximum VGS = \u00b120 V. Drive with VGS=10 V for full enhancement (RDS(on) typ 32.5 m\u03a9 at ID=10 A)."+ "description": "Gate. Insulated MOSFET gate; VGS(th) typ 2.8 V (2-4 V range), absolute maximum VGS = ±20 V. Drive with VGS=10 V for full enhancement (RDS(on) typ 32.5 mΩ at ID=10 A)." }, { "number": "2", "name": "D", "type": "passive",- "description": "Drain. Maximum drain-source voltage VDS = 135 V (VGS=0 V); continuous drain current ID = 30 A at TC=25 \u00b0C (20 A at TC=100 \u00b0C), pulsed IDM = 120 A. Electrically common with the TO-252 tab/heat slug (pin 4)."+ "description": "Drain. Maximum drain-source voltage VDS = 135 V (VGS=0 V); continuous drain current ID = 30 A at TC=25 °C (20 A at TC=100 °C), pulsed IDM = 120 A. Electrically common with the TO-252 tab/heat slug (pin 4)." }, { "number": "3",@@ -50,7 +50,7 @@ "number": "4", "name": "D", "type": "passive",- "description": "Drain (tab). The exposed thermal pad/heat slug of the TO-252 package is electrically connected to the drain and is the primary thermal path (R\u03b8JC = 1.25 \u00b0C/W). Solder to a copper pour tied to the drain net for heat spreading."+ "description": "Drain (tab). The exposed thermal pad/heat slug of the TO-252 package is electrically connected to the drain and is the primary thermal path (RθJC = 1.25 °C/W). Solder to a copper pour tied to the drain net for heat spreading." } ], "provenance": {@@ -120,5 +120,8 @@ "docs/agm13t30d-datasheet.pdf", "viewers/symbol.html", "viewers/footprint.html"- ]+ ],+ "visibility": {+ "public": true+ } }