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docs/runs/board-codex-20261007-1749/README.md+32−8
@@ -1,6 +1,6 @@ # AI Flow run: codex on board-0 -**Running**: step `routing`, 294.3 min of AI time since the prompt (2583.4 min on the wall clock). This page updates at every step change.+**Running**: step `thermal-vias`, 296.1 min of AI time since the prompt (2585.1 min on the wall clock). This page updates at every step change.  Prompt at 2026-10-07T17:49:14Z (UTC). Flow: board. Every number here is from the run's append-only ledger (run.jsonl). AI time is the time the AI was working on a prompt: from the human's prompt to the AI's done, with any gap over 15 min where no command ran (unobserved, not proven idle) cut out. @@ -17,8 +17,8 @@ One row per human prompt: the AI's time on it, unobserved gaps excluded by the h | 5 | 2026-10-09T09:59:18Z | (open) | 14.4 | 15 | Continue the electronic load through AIFlow to completion, keep dashboard progress visible | | 6 | 2026-10-09T10:28:54Z | (open) | 13.9 | 35 | Continue electronic-load engineering through AIFlow, with real dashboard progress and clip | | 7 | 2026-10-09T11:18:03Z | (open) | 4.6 | 69 | Keep going on AIFlow: continue electronic-load engineering and recorded board work. |-| 8 | 2026-10-09T12:31:28Z | (open) | 21.1 | 0 | Resume the electronic load through all AIFlow design gates after dashboard corrections; co |-| **all** | | | **294.3** | | |+| 8 | 2026-10-09T12:31:28Z | (open) | 22.9 | 0 | Resume the electronic load through all AIFlow design gates after dashboard corrections; co |+| **all** | | | **296.1** | | |  ## Per step @@ -28,15 +28,15 @@ AI time only, the idle cut out. |---|---|---|---|---|---|---|---| | intake | 2.6 | 0.3 | 2.2 | 3 | 1 | 0 | 0.3 min | | placement | 3.9 | 0.0 | 3.9 | 8 | 2 | 1 | 0.0 min |-| routing | 45.8 | 0.0 | 45.8 | 38 | 3 | 1 | 0.0 min |+| routing | 46.2 | 0.0 | 46.2 | 42 | 3 | 1 | 0.0 min | | components | 11.9 | 0.0 | 11.9 | 28 | 1 | 0 | 0.0 min | | design | 2.5 | 0.0 | 2.5 | 11 | 1 | 0 | 0.0 min | | libraries | 1.4 | 0.0 | 1.4 | 6 | 1 | 0 | 0.0 min | | models | 0.6 | 0.0 | 0.6 | 4 | 1 | 0 | 0.0 min |-| rules | 221.8 | 0.0 | 221.8 | 14 | 1 | 0 | 0.0 min |+| rules | 223.2 | 0.0 | 223.2 | 14 | 1 | 0 | 0.0 min | | test-plan | 0.1 | 0.0 | 0.1 | 5 | 1 | 0 | 0.0 min |-| thermal-vias | 3.7 | 0.0 | 3.7 | 43 | 1 | 0 | 0.0 min |-| **total** | **294.3** | **0.3** | **294.0** | | | | |+| thermal-vias | 3.7 | 0.0 | 3.7 | 44 | 2 | 0 | 0.0 min |+| **total** | **296.1** | **0.3** | **295.8** | | | | |  ## Returns to earlier steps @@ -58,9 +58,13 @@ AI time only, the idle cut out. - 2026-10-08T14:41:14Z capture-stop - 2026-10-08T14:51:51Z capture-stop - 2026-10-08T20:21:00Z capture-stop+- 2026-10-09T12:54:19Z clip-start:thermal-vias-2  ## Where the board stands +- routing: 0 unrouted after null passes+- gate: 0 new DRC errors, 0 unconnected, null inherited+- landed live: 0 of 0 route entries  ## The steps on camera @@ -210,7 +214,27 @@ What this step does: route to 100 percent with the spec's rules, gate with KiCad  Why the AI came back here: Adopt and recheck native USB layout and zero-ohm link revision before remaining thermal and fabrication stages -**Clip: routing, visit 3 (rework), still recording (started 2026-10-09T12:52:35Z); it appears here when the step ends.**+**Clip: routing, visit 3 (rework), the PCB editor from 2026-10-09T12:52:35Z to 2026-10-09T12:53:57Z. Motion only: 1.4 min of real time, 6 s of it had something moving; the clock in the corner is the real elapsed time.**++<video width="100%" controls><source src="/blob/app/adom-custom-electronic-load/docs/runs/board-codex-20261007-1749/routing-3.mp4" type="video/mp4"></video>++**Contact sheet: nine frames spread through the routing, visit 3 (rework) clip, what the camera saw.**++![nine frames of routing, visit 3 (rework)](/blob/app/adom-custom-electronic-load/docs/runs/board-codex-20261007-1749/routing-3-sheet.png)++**Screenshot: the board when routing, visit 3 (rework) ended.**++![the board when routing, visit 3 (rework) ended](/blob/app/adom-custom-electronic-load/docs/runs/board-codex-20261007-1749/shot-routing-3-end.png)++### thermal-vias, visit 2++What this step does: Heatsink vias where the heat is: for every part that dissipates real power (the regulator, the inductor, the catch diode, the FETs), an array of vias in its thermal pad or the copper it dumps heat into, stitched to the ground or the plane on the other side, sized and counted from its dissipation; the AI reviews the plan and the binary lands it.++**Clip: thermal-vias, visit 2, still recording (started 2026-10-09T12:54:19Z); it appears here when the step ends.**++**Screenshot: the board when thermal-vias, visit 2 began.**++![the board when thermal-vias, visit 2 began](/blob/app/adom-custom-electronic-load/docs/runs/board-codex-20261007-1749/shot-thermal-vias-2-start.png)  ## Plan usage, the second cost line 
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