Adom Custom Electronic Load

@@ -0,0 +1,11 @@+ERROR: current analysis not passed:+5V_AUX pass: the narrowest listed track carries the full specified load within 10 C+DUT_FUSED fail: DUT_FUSED carries 3.0 A on a 1.00 mm bottleneck (17 C rise, limit 10 C) and has no pour: pour it on the outer layers or widen to 1.5 mm+DUT_POS fail: DUT_POS carries 3.0 A on a 0.25 mm bottleneck (164 C rise, limit 10 C) and has no pour: pour it on the outer layers or widen to 1.5 mm+GND pass: pour on B.Cu+F.Cu (5201 mm2 filled) carries the load; tracks are 0.25 mm at most+LOAD_POS pass: pour on B.Cu+F.Cu (98 mm2 filled) carries the load; tracks are 1.50 mm at most+SHUNT_P pass: pour on B.Cu+F.Cu (38 mm2 filled) carries the load; tracks are 2.00 mm at most+(field screen: no field solve at aiflow/run/fields/fields.json; run adom-fields analyze --board aiflow/run/board-19.kicad_pcb --spec /home/adom/project/adom-custom-electronic-load/design/spec.json --out aiflow/run/fields, then analyze current --fields aiflow/run/fields/fields.json)+Hint: Fix what the failing lines say (pours, vias, widths, or placement), land it, measure again, then analyze again.+Hint: Now do the analysis yourself, not only this table: draw the current density on the copper (amps per square millimetre on every loaded net's pours and tracks; a Laplace solve on the filled copper between the source pads and the sink pads is enough, the board file has the filled polygons) as a 1920x1080 PNG with a colour scale, then `artifact --kind analysis-image --file <png> --caption "..."`. It becomes a fullscreen shot in the final video and a figure on the run page.+Hint: Then walk the pours this analysis judged on camera, under this same step: `tour nets --nets GND,LOAD_POS,SHUNT_P` (each net lit as a whole, pours and traces together, framed).

@@ -0,0 +1,37 @@+{+  "DUT_POS": {+    "sourceCenterMm": [+      108.0,+      100.0+    ],+    "sinkCenterMm": [+      105.0,+      91.0+    ],+    "minimumTrackWidthMm": 1.5,+    "ipc2221ExternalRiseAt3A_C": 8.581751511201757,+    "pathTrackIds": [+      "da79ab43-5f04-49aa-ad8d-811344153464",+      "059ce1a7-f433-469d-9b6a-678dc218a59a",+      "1ec11d4d-a7f8-43ba-89f2-d39a2f8a9acd"+    ],+    "scope": "Single exact-endpoint continuous front-layer main path only; excludes branch currents, pad necks, vias and terminal rating. Not a formal gate pass."+  },+  "DUT_FUSED": {+    "sourceCenterMm": [+      107.8,+      91.0+    ],+    "sinkCenterMm": [+      110.6,+      91.0+    ],+    "minimumTrackWidthMm": 2.0,+    "ipc2221ExternalRiseAt3A_C": 5.342087183005104,+    "pathTrackIds": [+      "c98a8edc-8857-4314-bd0c-e61288bf0fe8"+    ],+    "scope": "Single exact-endpoint continuous front-layer main path only; excludes branch currents, pad necks, vias and terminal rating. Not a formal gate pass."+  },+  "boardSha256": "54f1aab0a34622d1c3675c13f4aeb7a678b0cee8b5a4d3bfd7484b10edb8dcf6"+}

@@ -1,5 +1,7 @@ # Active completion contract +Current-step gate is explicitly failed: its width-only heuristic flags DUT_POS 0.25 mm and DUT_FUSED 1.0 mm, and a same-input formal Fields report is missing. The saved main-path review proves separate continuous front-layer paths of 1.5 mm and 2.0 mm respectively (IPC-2221 estimates 8.58 C and 5.34 C at 3 A), but excludes branch loads/pad necks and does not override the gate. See design/step12-main-path-review.json. Next work is a terminal-aware capacity check and supported same-board Fields integration, not blindly widening the voltage-sense branch.+ The active objective is to finish this electronic-load design through AIFlow, then its wiki/molecule/control-panel delivery and edited demo. Dashboard appearance, tool fixes and research are supporting work, not completion. After a supporting task, resume the earliest incomplete engineering gate without requiring another user nudge. Read this file and the live run on resumption; never infer completion from a previous chat response.  ## Latest accepted board@@ -10,7 +12,7 @@ Installed Fields remains 0.6.2; physical two-layer/plated-pad PR 5 is still open  ## Resume here -1. Inspect the live AdomLapper board and AIFlow run; current required step is pours. Board 19 is adopted; downstream proof refresh is running. Do not replay the successful native zone transaction. The outline check reports no sharp corners; record its proof after entering outline. Preserve the 5 W basis and unresolved physical cooling/Fields gates.+1. Inspect the live AdomLapper board and AIFlow run; current required step is current (12/19). Board 19 is adopted; routing/pour proofs and rounded-outline verification passed. Do not replay the successful native zone transaction. The outline proof is recorded. Repeated landing unexpectedly regenerated keepout UUIDs while preserving complete definitions; see design/step10-repeat-review.json. Preserve the 5 W basis and unresolved physical cooling/Fields gates. 2. Continue the compact 5 W prototype basis announced on 9 October. It follows the original size/cost priority and 5 V/1 A DUT. The prior 25 W assistant assumption is documented as a future option, not a blocker. Keep the 55 C trip and all validation requirements. 3. Solve the actual MOSFET case/interface/sink/fan assembly and probe clearance. The shunt-via candidate now passes only with the verified GND stitch at (133.018,77.818). Earlier candidates without that stitch disconnected ground; do not replay them. Via-count acknowledgements require actual engineering justification, not a desire to advance the timeline. 4. Complete and revalidate pours, outline, same-board current/thermal Fields screens, net tour, full fitted-model/silkscreen review, native 3D, finish and fabrication exports in the enforced sequence. Record significant real actions. Never mark these passed to bypass an unresolved gate.

@@ -0,0 +1,7 @@+KiCad Bridge 1.0.55; Adom Bridge 2.1.173 (a4e626c9-dirty); AIFlow 0.1.77; native KiCad 10.0.5 on Windows. Observed 2026-10-09.++Repeated `kicad_apply_zone_plan` is not idempotent for the two-layer copper-pour keepouts in the electronic-load run. First call creates two rule areas. After native refill/save/readback, submit the identical plan with the returned ownedItemIds and fresh expectedRevision. Expected: all nine zone IDs unchanged, no mutation. Actual: seven copper zones unchanged, but both keepouts removed and recreated with new UUIDs; success=true, committed=true, mutated=true. No error message; DRC errors=0, unconnected=0, warnings=15 inherited library lookup warnings.++Full canonical native zone definitions before/after are identical ignoring UUIDs, and filled areas are identical (F.Cu 2684.25 mm2, B.Cu 2653.06 mm2). Evidence and exact IDs are at https://wiki.adom.inc/adom/adom-custom-electronic-load/files/design/step10-repeat-review.json and the accompanying step10-repeat-land-pours.json. We stopped replaying rather than creating an endless adopt/invalidate/reland cycle.++Likely cause to verify against current source: generated keepout S-expression omits defaults that KiCad serializes (`connect_pads` clearance 0, min_thickness 0.25, disabled placement and island_removal_mode 0). Existing canonicalization handles some copper defaults but may not normalize rule-area defaults. Please add a native serialized keepout regression, preserve unknown properties and nondefault flags, and verify a second live call returns unchanged IDs and mutated=false. This report is not a source fix or deployed release.

@@ -6,4 +6,8 @@ The complete native transaction preserved all seven copper zones and added the t  This closes the native pour operation, not thermal qualification. Q1 still requires a verified case/interface/heatsink/fan assembly; the current and thermal Fields gates must use this saved board. The generic via-count exceptions and their engineering limits are in [via planning review](via-planning-review.md). -Two raw recordings were captured. Their contact sheets were reviewed; the longer successful transaction fully decodes. Most footage is static and will be excluded from the final action edit. The inventory contains 65 raw takes, including rejected takes, not 65 finished demo clips.+Two raw recordings were captured. Their contact sheets were reviewed; the longer successful transaction fully decodes. Most footage is static and will be excluded from the final action edit. The inventory contains 67 raw takes, including rejected takes, not 65 finished demo clips.++AIFlow subsequently recorded the rounded-outline proof and entered current analysis (12/19, 11 done). The repeated pour command unexpectedly regenerated the two keepout UUIDs despite identical complete zone definitions and filled areas; see `design/step10-repeat-review.json`. Do not replay the operation again.++The new 0.1 mm diagnostic converged on all five explicit main power paths: DUT_POS 42.0, DUT_FUSED 43.0, LOAD_POS 46.4, SHUNT_P 59.4 and GND 43.3 A/mm². All are below its 60 A/mm² threshold, with little shunt margin. It is an experimental electrical screen, not the formal current gate or thermal qualification. The formal gate remains failed pending terminal-aware heuristic handling and supported same-input Fields evidence.

@@ -1,8 +1,10 @@ # Current checkpoint — native pours accepted -AIFlow adopted board 19 after adding two Kelvin-sense copper-pour keepouts and preserving all seven existing copper zones. Native DRC reports zero errors and zero unconnected items, with 15 inherited library warnings. Step 9 is complete with documented generic via-count exceptions, not a thermal qualification. Routing and pour proofs are being refreshed against the new saved board before outline/current/thermal. See [pour review](pour-review.md) and [via planning review](via-planning-review.md).+Current-step gate is explicitly failed: its width-only heuristic flags DUT_POS 0.25 mm and DUT_FUSED 1.0 mm, and a same-input formal Fields report is missing. The saved main-path review proves separate continuous front-layer paths of 1.5 mm and 2.0 mm respectively (IPC-2221 estimates 8.58 C and 5.34 C at 3 A), but excludes branch loads/pad necks and does not override the gate. See design/step12-main-path-review.json. Next work is a terminal-aware capacity check and supported same-board Fields integration, not blindly widening the voltage-sense branch. -The video inventory now has 65 raw takes, including static/rejected footage. The latest successful pour recording fully decodes; only brief action is suitable for the final edit. Firmware remains output-locked, unflashed and physically unqualified; its latest build is 74,004 flash bytes and 24,192 RAM bytes including reservations. Fields PR 5 remains open. Cooling, formal current/thermal gates and fabrication release remain incomplete.+AIFlow adopted board 19 after adding two Kelvin-sense copper-pour keepouts and preserving all seven existing copper zones. Native DRC reports zero errors and zero unconnected items, with 15 inherited library warnings. Step 9 is complete with documented generic via-count exceptions, not a thermal qualification. Routing/pour proofs and outline verification passed; the timeline is at current analysis, step 12 of 19 (11 done). A repeated identical native pour plan recreated only the keepout UUIDs; full definitions and filled areas remained identical. The defect is preserved in design/step10-repeat-review.json; do not replay again. See [pour review](pour-review.md) and [via planning review](via-planning-review.md).++The video inventory now has 67 raw takes, including static/rejected footage. The latest successful pour recording fully decodes; only brief action is suitable for the final edit. Firmware remains output-locked, unflashed and physically unqualified; its latest build is 74,004 flash bytes and 24,192 RAM bytes including reservations. Fields PR 5 remains open. Cooling, formal current/thermal gates and fabrication release remain incomplete.  ## Historical checkpoints 

@@ -1,5 +1,5 @@ {-  "rawTakeCount": 65,+  "rawTakeCount": 67,   "reviewedExcerptCount": 16,   "countingRule": "Unique raw window recording filenames in this project; excludes derivative action/speed exports and reference projects. Raw count includes rejected takes.",   "takes": [@@ -392,6 +392,18 @@       "durationSeconds": 195.5,       "topic": "Native Kelvin keepout creation and copper refill",       "review": "Full decode passed and contact sheet reviewed. Most frames static; retain only brief actual refill transition if useful. Encoded duration is not an engineering stopwatch."+    },+    {+      "file": "aiflow/run/window-4654168-20261009-235626.mp4",+      "topic": "Outline verification: existing rounded corners",+      "durationSeconds": 3.3,+      "review": "Contact sheet reviewed: static PCB; exclude from final action edit. No visible corner edit or field solve shown."+    },+    {+      "file": "aiflow/run/window-4654168-20261009-235636.mp4",+      "topic": "Current-step entry before field solve",+      "durationSeconds": 23.3,+      "review": "Contact sheet reviewed: static PCB; exclude from final action edit. No visible corner edit or field solve shown."     }   ] }